News Article

Riber Joins III-V/silicon Program At IMEC

The world's leading silicon chip manufacturers are getting their hands on a cluster MBE tool supplied by Riber to ensure the long-term continuation of Moore's Law through the use of III-V materials.

Leading semiconductor research center IMEC, which is based in Belgium, is to install a "unique" MBE machine from French equipment vendor Riber.

The cluster tool, which is compatible with 200 mm (8-inch) wafer technology, will be used for a research program whose aim is to demonstrate the feasibility of using germanium and compound semiconductors in future CMOS processing.

IMEC is working with a whole host of the leading semiconductor manufacturing companies on a sub-45 nm node CMOS research program in which the Riber cluster tool will now feature.

Industrial partners in this effort include Intel, which makes more semiconductor chips than anybody else, as well as Infineon, Intel, Matsushita, Philips, Samsung, ST Microelectronics, Texas Instruments and the world's biggest foundry - Taiwan Semiconductor Manufacturing Company.

Riber s MBE machine will be used in the "germanium and III-V devices" element of that research effort, enabling deposition of compound materials on germanium or germanium-based wafers.

The machine will also be used to deposit high-k dielectric compounds to form the insulating layers of devices and metal contact layers, and IMEC says that these processes will be based on silicon wafers, ensuring compatibility with a standard silicon manufacturing line.

IMEC has already demonstrated the feasibility of sub-micron PMOS devices on a germanium wafer, but it says that other materials approaches and steps must now be developed to make very advanced CMOS devices.

It will now aim to show that germanium and III-V compounds could be used in devices beyond the 22 nm "node", which is currently expected to reach the volume production stage in about 2016.

CS International to return to Brussels – bigger and better than ever!

The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.

Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!


Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event