News Article

BinOptics Closes $6 Million Funding Round

BinOptics has raised $6 million to increase the production capacity of its telecom and datacom lasers that feature etched-facet technology.

BinOptics, a US manufacturer of monolithically integrated laser chips featuring etched-facet technology, has closed a Series C funding round that has raised $6 million.

The company says that the cash will be used to increase the production capacity of telecom and datacom 10Gbit/s lasers that can operate over a wide temperature range, and accelerate product development of etched-facet blue lasers for optical storage.

"The demand for competitively priced lasers that can operate reliably at high temperatures, speeds, and powers is now growing at a rapid rate," said BinOptics CEO Alex Behfar.

"Our unique manufacturing approach has allowed us to meet these requirements in the key material systems, and we are now ready to move to the next stage in production and product development," he added.

BinOptics products include proprietary 1310 nm and 1550 nm horizontal-cavity surface-emitting lasers (HCSELs). These emitters feature a chip technology that integrates a horizontal laser cavity with a 45° etched reflecting mirror that directs the beam vertically.

Series C funding was led by a new investor, STIC International, which is the US arm of STIC Investments, a South Korean venture capital and financial equity group.

BinOptics previous investors Draper Fisher Jurvetson, Cayuga Venture Fund, FA Technology Ventures, and Arrow Path Venture Partners, also participated in this funding round.

CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!

Register


×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
Live Event