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Tekcore leads laser system uptake

Tekcore successfully completes the installation of a suite of equipment, a marker on a course of firm growth in demand for JPSA's laser chip-processing tools.

J P Sercel Associates has qualified three new systems at Taiwanese high brightness LED maker Tekcore, as Asian LED companies invest to build on their already strong market position.

The Manchester, New Hampshire laser machining company has sold and installed two Chromadice wafer scribing and one Chromalift LED lift-off system at Tekcore's Nantou facility.

Nithi Nithipalan, Tekcore s president and CEO says he values the relationship with JPSA highly, because it provides his company with world-leading front-side scribing technology.

“It is important to us to maintain our global leadership position and to provide the best possible product to our customers worldwide,” Nithipan said. “JPSA equipment helps us do this, with systems that produce more die per wafer and industry leading throughput.”

Rapid integration of its JPSA's tools into production is also a strong suit, as the company sends teams all over the world to fit devices and train customers.

JPSA employs a patented precision beam delivery system in its Chromadice tools, allowing front-side singulation on sapphire LEDs that it claims can handle up to 20 percent more die per wafer than back-side methods, at a rate of twelve wafers per hour.

The Chromalift fires a laser through the back of the sapphire wafer to de-bond the LED device, ready for transferral to a heat sink or reflector, which JPSA says shortens device assembly times.

Demand for the Chromalift and Chromadice has been rising steadily through 2007, since JPSA completed the move of its operations to its Manchester site (see related story), a spokesperson said.

This demand is focused in Asia and the extent is demonstrated by Tekcore, who are already running the three new systems, with JPSA saying there are still more to come.

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