News Article

Goldeneye Targets Simpler LED Chips

Streamlining LED production processes to just an epitaxial step cuts manufacturing costs, improves extraction efficiency and aids thermal management, says Goldeneye.

LEDs manufactured using just epitaxy will be able to provide illumination at a fraction of the cost of their competitors, thanks to the simple process used to make them.

That s the word coming out of Carlsbad, California, where Goldeneye, Inc. is touting its EpiChip, ahead of commercial introduction in the fall of 2008.

“Based on improved efficiencies, a reduced number of process steps and associated yield losses, the cost of manufacture is significantly less than conventional methods," the company told

“Our intention is to use this technology in the design and fabrication of complete packaged light sources, not the sale of bare die," it added.

The general lighting market will benefit from the first packages featuring these die, which promise improved extraction efficiencies and thermal management.

To date Goldeneye has made blue and green GaN EpiChips, with high-quality, robust, epilayers ranging from 10 to 50 µm thick. Driving currents are better spread across these thick layers than in thinner LEDs and the chip's contacts are better separated, making packaging more straightforward.

Typical measured output for one of Goldeneye s 200 x 200 µm 520 nm EpiChips is 5 mW at 20 mA driving current. The company has also made EpiChips up to 1 mm2 in area, which attain a similar output at 500 mA to the 200 x 200 µm chips at 20 mA, it says.

EpiChips were originally developed to go into Goldeneye's light recycling systems - reflective cavities where the brightness of outputs from the similarly reflective LEDs they accomodate are enhanced. However, now the company has patented its “epi-only" approach for a wider range of applications.

Although Goldeneye is reluctant to release details about how and where its thick epilayer LEDs are made, its patents suggest that HVPE is used. Otherwise, the company says it outsources to an “ensemble of strategic partners, contract manufacturers, and primary vendors".

CS International to return to Brussels – bigger and better than ever!

The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.

Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!


Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event