News Article

Powerful Underwater Laser Communications

3S PHOTONICS, the French manufacturer of optical and optoelectronic components for telecommunication networks, and leading supplier of ultra-high reliability components for undersea optical networks today announced that it will unveil its Next- Generation 1996 SGP Series 980nm submarine-grade pump modules.
Capable of providing 600mW of ex-fiber optical power, the 1996 SGP Series is by far the industry’s most powerful 980nm pump laser module available as of today for submarine optical networking applications. Its unparalleled performance and ultra-high reliability levels enable cost-effective design solutions for the deployment of Next- Generation 10G & 40G optical amplifiers into the submerged repeaters which are distributed along the submarine intercontinental cables.

This new pump module complements the current high power pump generation – 1994 SGP - under field deployment for more than 3 years and address new customer needs for increased power.

“NEC is extremely pleased to deploy 3S PHOTONICS submarine pumps that Powerful underwater laser communications contribute to the successful deployment of state-of-the-art submarine cable systems" comments Osamu Harada, General Manager of NEC’s Submarine Networks Division. “New submarine systems will require much higher power levels and NEC has actively been collaborating with 3S PHOTONICS for the successful development and manufacturing of Next- Generation Submarine Cable Systems".

1996 SGP Series performance and ability to meet the extremely demanding submarine reliability requirements represents a key technological breakthrough for the submarine community, step-forward enabled by an ambitious development program launched by 3S PHOTONICS, many technical results of which have already been published in various proceedings. State-of-the-art performance has been announced with optimized chip structures allowing to reduce internal losses down to record values as low as 0.55 – 0.60 cm-1 and to keep high external efficiencies. New designs also allow to keep low junction temperatures and injection current densities. Those results translate to the completion of the initial objectives of increasing operating power in excess of 600mW at the module level while meeting the stringent reliability requirements.

The construction of those pump modules is based on the renowned double-lens coupling platform which has proven its reliability since active components are field deployed for more than a decade in quantities over twenty thousand worldwide with no failures. Extremely long term aging tests have demonstrated the extremely high stability of the construction and typical expected end of life (EOL) power drifts are less than 2% over a 25-year lifetime.

“This platform is today the most deployed in the world so we can proudly and solidly refer to our submarine experience without the need to consolidate reliability information captured from a terrestrial platform as our competitors do", said Yannick Bailly, VP Marketing and Product Management at 3S PHOTONICS. “Terrestrial information does not take into account the extended warranty periods requested by submarine customers and the imperative obligation of traceability for the product lifetime" he added.

3S PHOTONICS long-term strength in the area of high reliability products rely on wellmastered assembly technologies and processes, an extensive set of quality checks from kitting up to the final control before shipping, plus dedicated chip and module pedigree reviews. “These are the key elements to guarantee to our customers the quality and reliability levels required by the submarine community", said Michel Privat, COO and VP Sales for 3S PHOTONICS. “This new product enlarges our product portfolio for submarine applications and strengthen our position of strategic supplier with regard to submarine system makers".
CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!

Register


×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
Live Event