News Article

Semiconductor Miniaturisation 'supported By Implantable Neural Sensing Chip'

Semiconductor miniaturisation has been supported by the development of a new energy-efficient sensing chip, a technology resource has noted.
New prosthetics and brain machine interfaces have benefitted from the miniaturisation of electronic components including semiconductors and university researchers have aided this progress by developing an energy-efficient sensing chip.

Electrical engineers at the University of Washington have developed an implantable neural sensing chip that contains a microprocessor powered by a commercial radio-frequency reader, the Massachusetts Institute of Technology s Technology Review noted.

The reader doubles as a data-collection device which can read information from radio-frequency identification tags. This removes the requirement of other wireless medical devices which rely on inductive coupling that needs a nearby power source.

Current implantable devices require multiple components that are large compared to the transistors on the microcontroller, Brian Otis, professor of electrical engineering at the University of Washington, explained.

"You can have millions of transistors on a chip that s less than a cubic millimetre in volume, but the problem is with the extra parts," he stated.

Development of semiconductor mass production at 28 nanometres was recently announced by Samsung, which would allow a larger number of transistors to be fitted on to an integrated circuit of the same size.
ADNFCR-2855-ID-19447250-ADNFCR
CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!

Register


×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
Live Event