News Article

TSMC Breaks Ground On Fab For LED Lighting Business

TSMC today held a groundbreaking ceremony for its LED lighting R&D centre and fab in Hsinchu Science Park, setting an important milestone for the company's entry into green energy.

"To further strengthen long-term growth in TSMC's revenues and profits, we not only continue to pursue excellence in the field of dedicated IC foundry, we are also developing new businesses such as LED lighting and solar power," said TSMC Chairman and CEO Dr. Morris Chang. "With the leadership of President Dr. Rick Tsai and the hard work of all the colleagues involved, the strategy, goals, and execution of our new businesses have developed very successfully in the past several months. The groundbreaking for our LED lighting R&D centre and fab is an excellent example, and I look forward to even more progress once construction is complete."  

"LED lighting is a promising industry, and we will make full use of TSMC's technology leadership and manufacturing excellence in semiconductors to develop and integrate LED technology, process, and packaging and testing," said Dr. Rick Tsai, TSMC President of New Businesses. " We will enter the market next year by offering LED light sources and light engines to pursue the broad business opportunities of the LED lighting industry."

This LED fab is located on Li-Hsin Road 4 of the Hsinchu Science Park and will be built in two phases. Investment in plant and equipment for the first phase is expected to reach NT$5.5 billion, and equipment move-in is scheduled for fourth quarter of 2010 with volume production in the first quarter of 2011. TSMC will make decisions on construction of the second phase depending on future business needs.

TSMC is actively recruiting for its LED lighting business and welcomes talent in areas including technology development, process integration, product mechanical engineering, packaging, testing, equipment engineering, facilities, and business development.      

CS International to return to Brussels – bigger and better than ever!

The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.

Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!


Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event