News Article

Engis To Expand World Headquarters By 54,000 Square Feet

The expanded centre will house five labs. One of these will be The Wafer Process Lab (WPL), which serves the advanced material and compound semiconductor markets.

Engis Corporation, a provider of superabrasive finishing solutions for lapping, honing, polishing and grinding, plans to nearly double the size of its world headquarters in Wheeling, ILL, a Chicago suburb.

The company will expand its state-of-the-art manufacturing and warehouse facilities and create space for the new Engis Technology Centre.

 



Engis announced plans for a 54, 000-sq.-ft. expansion, shown here in an architectural rendering, that demonstrates the company’s commitment to superabrasives innovation, excellence in customer support and keeping jobs in the United States.

 

The 54,000-sq.-ft., multi-million-dollar expansion will bring total space to 121,500 sq. ft. and enable the company to consolidate all engineering, process development labs, manufacturing, warehousing and administrative offices into a single facility.

In conjunction with this project, Engis will add new manufacturing, process development and testing and measurement equipment. Construction will start in April and be complete by autumn 2011.

“This expansion demonstrates our long-term commitment to customers as a leading-edge provider of superabrasive solutions," says Stephen Griffin, president of Engis Corporation.

“For example, new automated manufacturing equipment will enable us to increase our ability to support global markets, while the Engis Technology Centre will enhance our capability to develop turnkey manufacturing solutions. It also demonstrates our commitment to keep and generate future jobs in Wheeling and in the United States."

The cornerstone of the expansion project will be the new Engis Technology Centre, where the company works hand-in-hand with customers to finish components to nanometre tolerances and achieve mirror surfaces.

The Centre will house five labs. One of these will be The Wafer Process Lab (WPL), which serves the advanced material and compound semiconductor markets. The Process Development Lab (PDL), will provide assistance for general industrial lapping and polishing inquires. The Bore Finishing Lab (BFL), will work closely with customers on honing and bore finishing applications in the automotive, hydraulic, medical, aerospace and defence industries.



“Consolidating all the labs in one location will enable us to concentrate our engineering resources and enhance our customer service activities," says Griffin.

Engis currently leases space for some of its process labs and other activities at a nearby location. All of these operations will be incorporated into the new expansion.

 
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