News Article

Positive Vibes Reverberate Through CS Europe

Compound semiconductor lasers and memories for making data communications greener, green laser pointers for picoprojectors and more advanced GaAs chips for tomorrow’s smart phones were all discussed at CS Europe.

On 22 March 150 delegates from around the globe flocked to Frankfurt, Germany, to attend CS Europe and capture an overview of the state of the compound semiconductor industry and find out where it is heading.



During this one-day meeting those attending could pick and choose from 18 talks that covered the broad spectrum of manufacturing activities occurring in the compound semiconductor industry.

Key note speaker for the event was the legendary MBE trailblazer Klaus Ploog, who reminded the audience of some of the hurdles that confront the industry – including the low efficiency of LEDs in the green, and droop that plagues nitride devices at high currents – plus opportunities in certain areas, including exotic compound semiconductor materials for memory.

The other speakers who spoke that day were:


  • Jeff Shealy, Division Vice President of RFMD who described the role of GaN RF Power Technology for tomorrow's commercial and defense wireless applications


  • Modulight’s president, Petteri Uusimaa, who explained how to make a state-of-the-art visible red laser, what its characteristics are, and what applications it can serve


  • Jan-Gustav Werthen, Senior Director,Photovoltaics at JDSU, who explained why there is an urgency for the world to make power grids digital (smart grids) and also described photovoltaic developments for electricity production from solar


  • Otto Berger, Corporate Advanced Technology Director of TriQuint Semiconductor, who detailed 3G/4G requirements for wireless systems and the role GaAs and GaN devices will play in meeting them


  • OMMIC’s CEO, Marc Rocchi, who gave his take on what's needed from GaAs and GaN for tomorrow's wireless


  • Alexander Bachmann, Marketing Engineer from OSRAM Opto Semiconductors, who outlined the company’s recent progress on green InGaN laser diode development


  • Christian Gartner, senior product engineer at OSRAM Opto Semiconductors, who considered the success factors for the deployment of solid state lighting


  • Markus Behet, Europe Business Development Manager, Dow Corning Compound Semiconductor, who discussed SiC advances for power electronic applications


  • Ulf Meiners, Chief Technical Officer, UMS and Mark Murphy, Director Marketing, RF Power & Base, NXP, who talked about high-performance compound semiconductors for infrastructure, automotive and defense applications


  • Philippe Roussel, Project manager Power Electronics and Compound Semiconductors


  • Yole Développement, who described the status and outlook of the GaN power electronics market


  • Ertugrul Sönmez, who heads up business development at MicroGaN, who detailed the company’s high-voltage GaN Devices and ICs for next-generation power management


  • IQE’s Roy Blunt, who covered standardization issues in compound semiconductors, which are an essential step for furthering the efficiency & profitability of the industry


  • Mike Czerniak Product Marketing Manager, Exhaust Gas Management, Edwards, who spoke about the company’s technology for reducing GaN emissions in the fab


  • Thomas Uhrmann Business Development Manager at EV Group, who discussed the role of engineered substrates for future compound semiconductor devices


  • Ian McKinlay, Senior Product Manager at Oxford Instruments Plasma Technology, who compared Batch and single wafer processing strategies for HB LED manufacture


  • Mike Wale Director Active Products Research at Oclaro, who talked about 100G networks


  • Giles Chappell Associate from McKenna Long & Aldridge LLP, who described the steps needed to ensure compliance with the new RoHS Directive



  • A more comprehensive account of CS Europe will appear in the April &May edition of Compound Semiconductor magazine.
    CS International to return to Brussels – bigger and better than ever!


    The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


    Join us face-to-face between 28th – 29th June 2022

    • View the agenda.
    • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
    • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

    *90% of exhibition space has gone - book your booth before it’s too late!

    Register


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