News Article

Anadigics InGaP PA Revolutionises LG’s Android

The firm’s HELP4 LTE power amplifier, which uses indium gallium phosphide technology enables the LG Android smartphone.

Anadigics, a manufacturer of RF products is shipping production volumes of its ALT6713 fourth generation High-Efficiency-at-Lower-Power (HELP4) LTE power amplifiers (PAs) to LG Electronics.


The ALT6713 is powering the Revolution by LG VS910smartphone for Verizon Wireless. The featured-packed Revolution by LG handset includes a large 4.3" capacitive touch screen, 1 GHz Snapdragon processor, 5.0 megapixel rear-facing camera, 720p video capability, Android 2.2 operating system, and 4G LTE connectivity. Anadigics’ ALT6713 PA is also used to power LG Electronics’ VL600 USB LTE modem.

“The selection of Anadigics’ power amplifiers for the Revolution by LG demonstrates the strength of the relationship forged between Anadigics and LG Electronics," said Michael Canonico, senior vice president of worldwide sales at Anadigics.

“We understand the challenges facing handset manufacturers today as the demand for power-hungry multimedia and high-speed data features continues to threaten battery-life. Leveraging our technology leadership, RF design expertise and engineering prowess, Anadigics has responded to these challenges by delivering the industry’s most efficient LTE power amplifier. We look forward to working with LG Electronics on the design of future platforms."

Anadigics’ HELP4 4G PAs use the Company’s exclusive InGaP-Plus technology to achieve optimal efficiency across low-range and mid-range output power levels. The ALT6713 helps improve battery life by combining the industry’s highest efficiency with an exceptionally low quiescent current. This world-class performance reduces average PA current consumption by 30%, compared with previous generation devices.

With a 35% PAE @ +27.5 dBm operating in the 777 MHz to 798 MHz frequency band (Band 13 and Band 14), the Anadigics ALT6713 has a low quiescent current of 3 mA. Optimised for LTE applications, the highly integrated module is claimed to have best-in-class linearity at maximum output power. It comes in a 3 mm by 3 mm by 1 mm footprint, has Internal voltage regulation and has a integrated “daisy chainable" directional RF coupler.
CS International to return to Brussels – bigger and better than ever!

The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.

Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!


Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event