EVG wins first order for ZoneBOND technology in compound semiconductor market
The firm is expanding its proprietary ZoneBOND temporary bonding/debonding process into the CS industry with its first order from a major player
EV Group (EVG) has received an order for its EVG850 temporary bonding/debonding (TB/DB) systems from a leading maker of compound semiconductor-based components.
This order marks the first implementation of ZoneBOND TB/DB technology in the manufacture of compound semiconductors, whose rapid growth is being driven by unrelenting demand for smart phones and other mobile products.
"The compound semiconductor market has always been a front runner in driving the introduction of new temporary bonding/debonding technologies – starting from solvent-assisted debonding, tape debonding, slide off debonding and now ZoneBOND," notes Thorsten Matthias, business development director for EVG.
"EVG has provided TB/DB equipment to the compound semiconductor market for over 10 years. And, the introduction of ZoneBOND is a natural evolutionary step. EVG's low-temperature debonding technology and our ZoneBOND Open Platform approach enable a standardisation of processes and equipment, which provides customers with a wide choice of bonding materials for increased flexibility during thin-wafer processing," adds Matthias.
Since its introduction in October 2011, ZoneBOND TB/DB technology has fast gained a foothold in the semiconductor industry. Companies such as Fraunhofer IZM ASSID, which has expertise in advanced semiconductor R&D, received ZoneBOND equipment for processes and materials qualification as part of a joint-development agreement with EVG.
With a strong supply chain supported by leading materials suppliers and continuing to expand, customers will only continue to have more and more flexibility to choose the material adhesive that best suits their manufacturing requirements and processes.
Initially created to drive the advancement of 3D IC commercialisation, EVG's ZoneBOND technology provides a breakthrough approach for temporary wafer bonding, thin-wafer processing, and debonding applications – overcoming the last remaining limitations associated with thin-wafer processing.
Benefits of ZoneBOND technology include: standardisation of processes and equipment, the use of silicon or glass carriers; compatibility with existing, field-proven adhesive platforms; and the ability to debond at room temperature with virtually no vertical force being applied to the device wafer.
To support grinding and backside processing at high temperatures and to allow for low-force carrier separation, ZoneBOND defines two distinctive zones on the carrier wafer surface with strong adhesion in the perimeter (edge zone) and minimal adhesion in the centre zone.
As a result, low separation force is only required for carrier separation once the polymeric edge adhesive has been removed by solvent dissolution or other means. The EZR (Edge Zone Release) and EZD (Edge Zone Debond) modules can be easily integrated in EVG's high-volume manufacturing equipment platforms such as the EVG850 TB/DB Series.