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RFMD Introduces Integrated InGaP PA Modules For WiFi

The devices are built using the firm's advanced indium gallium phosphide HBT process


RFMD’s new RFPA520x series of three-stage WiFi PA modules are designed for 802.11b/g/n applications.

Other uses include consumer premise equipment, picocells, femtocells, data cards and terminals and ISM band transmitter applications. They can also be used in wireless access points, gateways, routers and set top box appliances.

Each is a high-performance, highly integrated solution with minimal external components, eliminating the need for any external matching components and greatly reducing layout area, bill of materials and manufacturing costs for the customer application.

These PAs have high linear output power while maintaining excellent power added efficiency (PAE). RFPA5200 comes in a 4mm x 4mm x 1mm, 10-pin laminate package, while RFPA5201 comes in a 14-pin, 7mm x 7mm Multi-Chip Module (MCM).

Features include:

POUT:   RFPA5200: 27dBm, 5V < 3% Dynamic EVM   RFPA5201: 29dBm, EVM = 3%; 11n MCS7 HT40

High PAE:             RFPA5200: 21%                RFPA5201: 18.5%

High gain:            RFPA5200: 33dB               RFPA5201: 33.5dB

Input and output matched to 50Ω

Integrated power detector, biasing, harmonic filtering, and enable pin

Both parts are available now in production quantities. Pricing for 5000 pieces begins at $1.26 each for RFPA5200 and $2.64 each for RFPA5201.



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