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Nordson showcases phosphor for coating and encapsulation for LEDs

The firm is exhibiting its latest products at LED Korea
Nordson ASYMTEK will demonstrate dispensing solutions for LED and semiconductor packaging at LED Korea 2013.

Applications include phosphor coating for tight CIE LEDs, high-throughput silicone phosphor encapsulation, pure silicone casting, flux, and underfill for flip chip, package-on-package (PoP), chip scale packages (CSP), and ball grid arrays (BGA).



Nordson ASYMTEK LED encapsulation system DJ9500

Also on display will be Nordson ASYMTEK’s new NexJet Dispensing System with the one-piece Genius Jet Cartridge. The firm says the system makes dispensing faster, easier, and smarter.

Nordson ASYMTEK’s Spectrum S-922N-LED work cell offers consistent dispensing volume for high yields in LED encapsulation. The dual simultaneous jets deliver high throughput that benefits high-volume production and achieves a low-cost solution. The system uses patented CPJ (Calibrated Process Jetting) for automatically ensuring volumetric repeatability during long production runs.

The LED Industry needs technology to deposit conformal phosphors on die or optics for consistent bin control; however, it is challenging to keep the phosphor dispersion in suspension and uniformly mixed.

Nordson ASYMTEK’s Spectrum phosphor coating solution meets these challenges. The system includes air management to address safety concerns, a robust interior to minimise damage from phosphor particles, and heated tooling for your specific application.

The company will showcase its latest products at LED Korea 2013, booth #4228, Hall B.

LED Korea is being held in conjunction with SEMICON Korea, COEX, Seoul, between January 30th and February 1st, 2013.

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