News Article
Lumileds unveils die-level LUXEON Flip Chip LED technology
The firm says this allows luminaire manufacturers to gain exceptional access to Philips Lumileds' technology
Philips Lumileds has developed new LUXEON Flip Chip LED devices that will enable the next generation of lighting applications by providing luminaire manufacturers with more design flexibility.
Users can now access Philips Lumileds technology through a robust LUXEON Flip Chip die format giving them greater design options than in the past.
“Now luminaire manufacturers can enjoy the best of both worlds, by either incorporating packaged LEDs as they did in the past, or by starting with the LED die and customising the phosphor and packaging to best suit their lighting application,” says Pierre-Yves Lesaicherre, CEO of Philips Lumileds.
While traditional wire bonding limits the packing and power density of LEDs, LUXEON Flip Chip LEDs can be packaged closer and can be driven at a higher current density. This requires fewer emitters to achieve a higher lumen output at higher lumen densities, a capability that is especially advantageous with chip-on-board and other high-power applications.
One design advantage is large p and n bond pads that improve LUXEON Flip Chip packaging reliability
“The end result is that luminaire manufacturers can achieve higher lumens per dollar through higher lumen densities and a straightforward packaging process,” notes Lesaicherre.
The robust design of Philips Lumileds LUXEON Flip Chip LED die enables LED lighting with high lumen output per dollar
Philips Lumileds introduced high-power LUXEON Flip Chips in a 1.0 mm x 1.0 mm format. As is the case with all LUXEON LEDs, these chips take advantage of Philips Lumileds' epitaxial technology, materials and design.
Users can now access Philips Lumileds technology through a robust LUXEON Flip Chip die format giving them greater design options than in the past.
“Now luminaire manufacturers can enjoy the best of both worlds, by either incorporating packaged LEDs as they did in the past, or by starting with the LED die and customising the phosphor and packaging to best suit their lighting application,” says Pierre-Yves Lesaicherre, CEO of Philips Lumileds.
While traditional wire bonding limits the packing and power density of LEDs, LUXEON Flip Chip LEDs can be packaged closer and can be driven at a higher current density. This requires fewer emitters to achieve a higher lumen output at higher lumen densities, a capability that is especially advantageous with chip-on-board and other high-power applications.
One design advantage is large p and n bond pads that improve LUXEON Flip Chip packaging reliability
“The end result is that luminaire manufacturers can achieve higher lumens per dollar through higher lumen densities and a straightforward packaging process,” notes Lesaicherre.
The robust design of Philips Lumileds LUXEON Flip Chip LED die enables LED lighting with high lumen output per dollar
Philips Lumileds introduced high-power LUXEON Flip Chips in a 1.0 mm x 1.0 mm format. As is the case with all LUXEON LEDs, these chips take advantage of Philips Lumileds' epitaxial technology, materials and design.
