The tool will be used in the manufacture of GaN and GaP LEDs

Advanced Laser Separation International (ALSI) N.V. introduced its new laser dicing system, the ICA 1204 for GaN and GaP devices, at one of the world’s largest major LED manufacturers with great success.





ICA 1204 laser dicing system

The ICA1204 system is equipped with a specific UV laser and ALSI’s unique multi-beam laser splitting technology.

The overall process is based on a high speed full cut laser dicing process for wafers in the range of 150-200µm thick. Due to the specific nature of the applied coating, additional special coating process units were integrated into the system.

As a result, this new system outperformed ALSI’s previous models and a competitors system with significant results. The total cycle time including the specific coating process, multi-beam dicing and wafer cleaning, which are completely integrated in the system, was reduced by almost a factor two.

Since all the process steps are integrated inside the system, the operator cost and handling cost are reduced as well. ALSI says this combination of faster cycle time, reduced handling time, and fast dicing process, also reduced the overall cost per wafer by a factor 2.

The multi-beam process is based on 10-14 beams which achieves a very high dicing speed and a fast process time, while creating an extremely narrow kerf giving superior dicing quality.

This new process and system has been tested by customers resulting in firm orders and is used in full production.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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