Info
Info
News Article

Can RFaxis` Silicon FEM Devices Kick GaAs?

Yes it can, according to Frost & Sullivan. The market research firm says RFaxis' cost effective technology is helping wireless devices achieve performance and quality that is comparable to a wired network


Based on its recent analysis of the market for radio frequency front-end module (RF FEM) solution for wireless communication, Frost & Sullivan honoured RFaxis, Inc. with the '2014 North American Frost & Sullivan Award for Technology Innovation Leadership'.

RFaxis leveraged its single-chip/single-die RF Front-end Integrated Circuit (RFeIC) architecture to develop unique RF front-end solutions for wireless communications.

These innovative solutions, which combine superior performance capabilities with affordability, also prove to be ideal alternatives to conventional gallium arsenide (GaAs) solutions.

RF front-end solutions are traditionally built by embedding active and passive multiple components on a substrate using GaAs. The hybrid integration of passive and active compounds forms a multi-chip RF FEM, resulting in a large package size and bigger footprint on the printed circuit board (PCB).

However, with the semiconductor industry for wireless communication moving from bulky, multiple integrated chips to leaner, single chips, RFaxis' RFeIC solutions are gaining prominence for being highly integrated on a single silicon-based chip.

Frost & Sullivan's research indicates that RFaxis has succeeded in developing the world's first single-chip/single-die integrated circuit architecture based purely on standard complementary metal oxide semiconductor (CMOS) technology.

And the firm syas its quality and performance are comparable with GaAs-based RF front-end solutions, while its cost structure, thermal conductivity and ruggedness are far superior.

"Apart from reducing the time to design and market, RF front-end level of integration offers device manufacturers a very simple solution that can be implemented as a plug and play," says Frost & Sullivan Sr. Research Analyst Swapnadeep Nayak. "RFaxis' technology helps OEMs reduce their product development cycles to as low as a few weeks, while competing solutions take months. It satisfies every performance criterion set forth by component manufacturers and original equipment manufacturers (OEMs)."

F&S says that unlike CMOS, GaAs is a niche domain, which does not have adequate foundry capacity to meet the global demand from the semiconductor industry and OEMs. Migrating to CMOS technology lowers the strain on the supply chain, which helps device manufacturers cope with demands from the industry.

RFaxis' technology offers substantial price reduction in comparison to incumbent solutions. It also helps system-on-chip (SoC) vendors and OEMs integrate the company's solutions with other modules.

The comparison of all RF Front-end solutions shows that RFaxis is among the few participants that integrate the key RF front-end components of power amplifiers, low noise amplifiers, and switches into a CMOS SoC.

Such a high degree of integration has a direct bearing on RF front-end innovations for the wireless local area network (WLAN), long term evolution (LTE/4G), and Machine-To-Machine communications markets.

RFaxis' technology powers a wide range of application segments that use wireless communication as a key platform, the main ones being broadband (gateways, set-top boxes, video streaming applications), mobile devices (smartphones), and the Internet of things (IoT).

RFaxis is also looking at the smart TV and remote control segments to transform them from mere devices to gadgets that perform functions, such as music and video streaming.

"The wireless application ecosystem is evolving with the advent of Zigbee, 4G, near field communication, and the IoT, and RFaxis' technology helps OEMs ease into this transition by helping wireless communication devices perform faster," notes Nayak. "Frost & Sullivan's benchmarking shows that RFaxis is efficiently extending the range of wireless communication applications through its RFeIC solutions without increasing the form factor or cost."

Every year, Frost & Sullivan presents this award to the company that has demonstrated uniqueness in developing and leveraging new technologies, which significantly impacts both the functionality and the customer value of the new products and applications. The award lauds the high R&D spend towards innovation, its relevance to the industry, and the positive impact on brand perception.

 



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event