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Nujira: Envelope Tracking - transforming the performance of CMOS and GaAs PAs

Presentation at CS International conference
Envelope Tracking technology is being rapidly adopted by the smartphone industry to boost the energy efficiency of RF Power Amplifiers in 4G smartphones. 

In addition to boosting energy efficiency, ET fundamentally changes the operating mode of the PA, enabling designers to push device performance beyond traditional boundaries. 

The presentation will introduce the basics of ET technology, explain how it impacts both CMOS and GaAs PA designs, and how it has the potential to transform the RF front-end landscape for 3G, 4G and WiFi standards.

CS International 2014 - 18th, 19th March, 2014, Frankfurt, Germany

To gain a comprehensive overview of the entire compound semiconductor industry, the must attend event for 2014 is the 4th CS International conference in Frankfurt, Germany.

Delegates will get the unique opportunity to network with leading industry professionals of the III-V chip making industry, interact with suppliers and industry experts who will deliver the latest research, business models, and insights aligned to their job roles. 

During the two days, delegates will have the unique opportunity to listen to six key themes and 36 inspiring presentations. Hear about the breakthroughs in device technology; insights into the current status and the evolution of compound semiconductor devices; and details of advances in tools and processes which could help boost fab yields and throughputs. 

CS International is established as the industry’s leading international conference attracting delegates and sponsors from the global compound semiconductor industry. 

Last few delegate places left, book today!
http://www.cs-international.net/register.php
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