News Article

MEI's GaAs BiFET Tool Set To Lift Off

The FluidJet metal liftoff system is claimed to eliminate device damage, while using 80 percent less chemical than current single wafer processing solutions

MEI has revealed its FluidJet batch wet processing system for metal liftoff in MEMS manufacturing, delivering higher yielding, more cost effective metal liftoff processing.

MEI says its FluidJet batch wet processing system for metal liftoff achieves no metal re-deposition on either the front side or back side of the wafer, eliminates device damage, while using 80 percent less chemical than current single wafer processing solutions. 

FluidJet also enables efficient, easily obtained gold and metal reclaim, reducing waste and downtime. FluidJet could also save manufacturing floor space by reducing the wet process footprint requirement by at least 60 percent over comparable throughput single wafer spray tools.

"By adopting the FluidJet metal liftoff system, semiconductor manufacturers will increase yield while reducing downtime and chemical costs and disposal," says Dan Cappello, President and CEO, MEI LLC. "FluidJet cleans the surface gently improving metal liftoff performance at a lower cost. Side by side "split lot" comparison data demonstrates superior performance on liftoff and resist strip layers while also reducing defects."

MEI says its FluidJet metal liftoff system is unlike conventional single wafer metal liftoff systems. Conventional metal liftoff solutions rely on high-pressure sprays that produce metal debris that can scratch or tear fine metal features. Metal debris can also redeposit, causing shorts.

The FluidJet batch immersion system's gentle removal and self cleaning tanks enable lifted metals to be more easily and completely reclaimed. Strainer baskets are emptied in minutes and sized to easily hold several thousand wafers worth of lifted metal.

MEI's FluidJet targets semiconductor and MEMS processing applications where Metal Liftoff is required to create GaAs BiFET device structures for mobile communications

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.



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