Info
Info
News Article

Obducat Reveals Mass Production Tool For LEDs And Optics

The second generation SINDRE system enables throughputs of up to sixty wafers per hour. It has been delivered and passed customer final approval in January
Obducat, a manufacturer of lithography solutions based on nanoimprint lithography (NIL), has launched its 2nd generation SINDRE.

With the improved performance it will represent a cost effective NIL production solution on the market. The system is based on Obducat’s patented SoftPress, IPS and STU technologies.



SINDRE 400 G2

The fully automated SINDRE system enables throughputs of up to sixty wafers per hour.

The new SINDRE integrates the latest advances in manufacturing technology which enables high throughput, high repeatability at a defectivity level which surpass industry requirements.

The first system has already been delivered and passed customer final approval in January this year and the next system will be delivered in third quarter this year.

The new SINDRE platform is a fully integrated NIL system which includes integrated fabrication of the Intermediate Polymer Stamp (IPS). This is a proven and reliable process which was also integrated in previous generation of SINDRE systems delivered by Obducat during the last five years.

Obducat’s patented IPS technology covers the use of a transparent flexible stamp in any kind of imprint process. The use of the IPS technology ensures a long life time of the stampers which minimise the stamp related costs per imprint.

The patented SoftPress technology, applied in the system, ensures the necessary level of conformity between the stamp and substrate vital for establishing high imprint uniformity. This enables a large process window for downstream processes leading to a high yield and low Cost of Ownership. All this has been integrated into a very compact system having a small footprint.

The new SINDRE system also offers a wide flexibility which includes the possibility to use different resists and IPS materials to support customisation of the imprint process. In addition the system can run both UV as well as thermal based NIL processes, giving the capability to imprint structure sizes ranging from 20nm and upwards, on substrate sizes up to 200 mm in diameter.

“The versatility and superior performance of our patented key technologies has been extended further to safeguard Obducat’s continued technological leadership in the NIL industry," says Babak Heidari, CTO of Obducat.

Example of components which are ideally produced with this system are optical, photonic, LEDs, fluidic and other biomedical components.

“Obducat again confirms its leading position with this launch. With more than 130 NIL systems delivered during the last decade and several of these being used for manufacturing purposes in LEDs, photonics and biomedical applications, we are breaking new barriers in terms of performance and cost efficiency" says Patrik Lundström, CEO of Obducat.





AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event