A report about GaN-on-silicon patents by KnowMade, the French specialists in analysis of scientific and patent information, is now available from Research and Markets. Profiles of 15 major companies are presented with key patents, technological issues, litigations, licenses, partnerships, IP strength and IP strategy.
The report provides patent data for GaN on silicon substrate related to main material issues such as dislocation density reduction and stress management for preventing crack generation and warpage of the wafer. Companies covered include Azzurro, Dowa, International Rectifier, LG, Mitsubishi, NGK Insulators, Nitronex, Panasonic, Samsung Electronics, Sharp, Soitec, Sumitomo, Toshiba, Toyoda Gosei, and Toyota.
The report identifies more than 50 holders of GaN-on-Si related intellectual property. It provides in-depth analysis of key technology segments and players including time evolution of patent publications and countries of patent filings, current legal status of patents, ranking of main patent applicants, joint developments and IP collaboration network of main patent applicants, key patents, granted patents near expiration, relative strength of main companies IP portfolio, and overview of patent litigations.
The report also provides an Excel database with all patents analysed in the report with technology segmentation.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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