Info
Info
News Article

The Next Graphene?

News
$1.7m US research grant to focus on new 2D materials

A team of engineering researchers from California has been awarded a $1.7 million grant from the US National Science Foundation (NSF) to characterise, analyse and synthesise a new class of ultra-thin film materials that could improve the performance of personal electronics, optoelectronic devices and energy conversion systems.

The potential of layering two-dimensional materials into novel heterostructures held together by weak van der Waals interactions is attracting increasing attention. Graphene has already been well studied but dozens of these one-atom- or one-molecule-thick crystals are known including monolayers of MoS2, hexagonal boron nitride, WSe2, graphane, fluorographene, mica and silicene. Researchers at Vienna University of Technology, for instance, recently reported developing a new compound semiconductor structure combining tungsten diselenide with molybdenum disulphide to create a 'designer' optoelectronic material.

The Californian team is led by Alexander Balandin, University of California, who is founding chair of the materials science and engineering program at UC Riverside's Bourns College of Engineering. (A group led by Balandin at UC Riverside previously discovered the unusually high thermal conductivity of graphene.)

Other members of the team are Roger Lake, a UC Riverside professor, Alexander Khitun, a UC Riverside research professor, and Tina Salguero, an assistant professor at the University of Georgia.

This project will investigate novel electrical, optical, and thermal phenomena in such materials and heterostructures. The research is expected to produce new material synthesis techniques and enable practical applications of ultra-thin film materials in electronic switches, optical detectors, low-power information processing and direct energy conversion.

Each member of the NSF-funded team will cover different aspects of the research and application of the van der Walls materials. Balandin will conduct materials characterization, fabrication and experimental testing of nanodevices, Lake will perform the first principal theoretical analysis and computer simulation of the properties of new materials and devices. Khitun will design circuits and systems based on two-dimensional materials and atomic heterostructures. Salguero will synthesize new materials using chemical approaches.

The NSF funding was awarded via the Emerging Frontiers in Research and Innovation (EFRI-2014) program called Two-Dimensional Atomic-layer Research and Engineering (2-DARE).



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event