Evatec Expands Asian Sales And Service Network
Agency agreement with DKSH completes next step of growth plans
Following the recent acquisition of the semiconductor and nanotechnology business of Oerlikon's Advanced Technologies Segment, Evatec, the Swiss thin film deposition company, has completed the next step of its growth plans for Asia.
At Semicon China this week, Evatec signed an agency agreement with Zurich-based global services supplier DKSH for the sale and service of its range of thin film production platforms to customers in China and Taiwan.
Evatec CEO Andreas Waelti commented: "DKSH is already recognised as number one in the delivery of high quality market expansion services and the agreement brings us access to its market know how and experienced sales and service professionals.
"They are the perfect partner for supporting the growth of our business in next generation UBM [under bump metallisation) solutions with unparalleled throughput and plasma damage free GaN sputter processing solutions for our customers in advanced packaging, power semiconductors and LED"
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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