Info
Info
News Article

Leti Demos Process To Make Micro-LED Arrays For Wearable Vision

News
GaN and InGaN on silicon backplane targets market for smart glasses and head up displays

French research organisation CEA-Leti has demonstrated a path to fabricating high-density GaN and InGaN micro-LED arrays for next generation wearable and nomadic vision systems. The process is said to be scalable to the IC manufacturing process.

Head-mounted and head-up displays for aeronautics and automotive applications, and smart glasses with augmented reality for consumers, are expected to grow dramatically in the next three to five years. Research firm MarketsandMarkets forecasts the market for head-up displays alone to grow from $1.37 billion in 2012 to $8.36 billion in 2020.

Announced during Display Week 2015 in San Jose, California, Leti's innovation is based on micro-LED arrays that are hybridised on a silicon backplane. Key innovations include epitaxial growth of LED layers on sapphire or other substrates, micro-structuration of LED arrays (10µm pitches or smaller), and 3D heterogeneous integration of such LED arrays on CMOS active-matrices.

These innovations make it possible to produce a brightness of 1 million cd/m2 for monochrome devices and 100 kcd/m2 for full-colour devices with a device size below one inch and 2.5 million pixels. This is a 100- to 1,000-times improvement compared to existing self-emissive microdisplays, with very good power efficiency, according to Leti. The technology should also allow fabrication of compact products that reduce system-integration constraints.

The high-density micro-LED array process was developed in collaboration with III-V Lab, a private R&D organisation jointly established by Alcatel-Lucent and Thales in 2004 under the French 'Economic Interest Group' (GIE) status.

LED microdisplays are suited for such wearable systems because of their low footprint, low power consumption, high-contrast ratio and ultra-high brightness, says Leti. "Currently available microdisplays for both head-mounted and compact head-up applications suffer from fundamental technology limitations that prevent the design of very low-weight, compact and low-energy-use products," said Ludovic Poupinet, head of Leti's Optics and Photonics Department. 

"Leti's technology breakthrough is the first demonstration of a high-brightness, high-density micro-LED array that overcomes these limitations and is scalable to a standard microelectronic large-scale process. This technology provides a low-cost, leading-edge solution to companies that want to target the fast-growth markets for wearable vision systems," he added.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event