Info
Info
News Article

Chinese Investment Fund To Launch Offer For Aixtron

Fujian Grand Chip Investment Fund to offer around â‚¬670 million for German deposition company

German semiconductor deposition firm Aixtron and Grand Chip Investment GmbH, a 100 percent indirect subsidiary of Fujian Grand Chip Investment Fund LP have entered into an agreement to take over Aixtron.

Fujian Grand Chip Investment Fund is a Chinese investment fund; 51 percent of which is held by the Chinese business man Zhendong Liu and 49 percent by Xiamen Bohao Investment Ltd.

Under the terms of the agreement, Aixtron shareholders will be offered €6.00 in cash per each ordinary share. The transaction values Aixtron's equity, including net cash, at approximately €670 million and reflects a 50.7 percent premium to the three-month volume weighted average share price prior to announcement.

The offer shall be subject to certain closing conditions, including regulatory approvals and a minimum acceptance threshold of 60 percent of all of Aixtron's outstanding shares.

The agreement sets out the purpose and the principal terms of the transaction with FGC and the future strategy. FGC intends to support Aixtron's strategy going forward.

R&D competency and Aixtron's existing technology shall be maintained at the existing technology centers. FGC has also agreed that Aixtron shall further strengthen its technology and IP Portfolio, which shall remain vested with Aixtron, including in Germany.

Aixtron's existing global set up will be maintained and expanded with Aixtron's three technology hubs in Herzogenrath (Germany), Cambridge (UK) and Sunnyvale (USA). Further international technology hubs may be established. Aixtron's legal domicile and headquarters shall remain in Herzogenrath, Germany.

In the event the takeover is successful, Martin Goetzeler is to remain CEO of Aixtron and Dr. Bernd Schulte is to remain in his function as COO.  Following a successful closing of the transaction it is anticipated that Grand Chip Investment will nominate four candidates to the six-member Supervisory Board.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event