Samsung Introduces chip scale LEDs for cars
Samsung Electronics has introduced Fx-CSP, a range of LED packages which feature chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.
The new LEDs were recently selected for a compact car headlamp project from one of the major global automotive manufacturers.
Samsung's new Fx-CSP provides a combination of chip-scale packaging and flexible circuit board technology, which together enable more compact chip sizing and a higher degree of reliability, according to the company. The use of a flexible circuit board also enables more heat to dissipate, which leads to lower resistance and brings about a greater degree of lumen-per-watt efficiency than using a ceramic board.
In addition, the new Samsung automotive LED line-up allows car designers to use a variety of chip arrangements such as a single chip, a 1 by 4, or a 2 by 6 multi-chip arrangement to suit different lighting configurations. The Fx-CSP line-up can be widely used in automotive lighting applications that include position lamps and daytime running lamps as well as headlamps that require higher luminous flux and reliability than other automotive lamps.
The Fx-CSP line-up consists of single packages, Fx1M and Fx1L, with 1-3 watts each, as well as packages with a 14W high voltage array, Fx4 and a 40W high voltage array, Fx2x6. The variation in wattage levels allows Samsung LED lighting packages to work well with a wide range of exterior automotive lighting.
Samsung plans to introduce more CSP technology-based LED components such as the new Fx-CSP line-up for automotive lighting, later this year.
