Products

Multi-layer deposition system for manufacture

AFTEX-6000series

Solid-source ECR plasma deposition system that makes it possible to form multi-layer films from a large number of materials.

  • Low temperature process
  • High refractive index control
  • High-speed reactive film formation
  • Multilayer film

A solid-source electron cyclotron resonance (ECR) plasma deposition system forms high-quality thin films by directly reacting a low-pressure, high-density ECR plasma flow with particles sputtered from a solid source (target) placed at the outlet of the plasma flow. AFTEX-6200 is equipped with two ECR plasma sources and enables automatic transfer and deposition, which is optimal for multilayer film deposition.

  • Deposition Characteristics
  • Product Features
  • Standard Specification
  • Principles and Features of ECR Plasma Deposition
Deposition Characteristics

Membranes and multi-layer films of wide range of materials

Any solid material that can be fabricated into a sputtering target can be used as the raw material, so films of various oxides and nitrides can be formed, as well as multi-layer films, by combining them with introduced gases such as oxygen or nitrogen. For example, if Si is used as the solid source, it is possible to form single-layer and multi-layer films of SiO2, Si3N4, and Si.

High refractive index control

Since there are direct reactions between a solid source and an oxygen or nitrogen ECR plasma flow, high-refractive index control is possible, with no generation of intermediate products as happens with CVD. In addition, films having any desired refractive index can be created simply by making oxygen and nitrogen flow simultaneously.

High-reactivity deposition

Rapid deposition is enabled by reactions between a solid source and a large-current ECR plasma of a gas such as oxygen or nitrogen.

Low-temperature, low-damage, surface cleaning effect

Deposition is by the ion-assist effect at a low energy but high current, making it possible to form high-quality, highly crystalline thin films at low temperatures and with low levels of damage, in comparison with conventional deposition methods. Cleaning of the substrate and grown surfaces can also be expected.

Product Features
Standard Specification
Principles and Features of ECR Plasma Deposition

Drawing & Diagram



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