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Corporate Partners » III/V-Reclaim





III/V-Reclaim

Reclaim (recycling) of GaAs and InP wafer. We remove all layers, structured or non structured, all metallisations, implanted, epitaxial and protective layers. We handle all formats and sizes. Thin wafer of 50 micron can be manufatured. We offer single side, double side polishing and ready-to-use surface treatment.

Contact:   Website: http://www.35reclaim.de/
Phone:   Email:
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