Strathclyde has secured a spin-out deal to form a company working in the field of novel next-generation light source technology, which could open up a range of opportunities in multi-billion dollar applications including neuroscience, microscopy and communications.
EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, have announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility.
The compact HMC-T2240 allows the user to sweep across many microwave and millimeterwave frequency bands with a single synthesizer and is claimed to offer the best value for money compared to other similar products
Avago Technologies, Finisar Corporation, Opnext, Inc. and Sumitomo Electric Industries, Ltd. today announced that Revision 1.4 of the CFP Multi-Source Agreement (MSA) hardware and firmware specification documents is now available on the CFP MSA website at: www.cfp-msa.org. In addition, the three companies, which founded the CFP MSA and first announced it in March 2009, welcome Avago Technologies as a new member.