Experienced Executive to Spearhead Product Strategy and Market Growth for Thin Film CIGS Leader; Jean-Noel Poirier Appointed Vice President of Marketing, Business Development and Tim Teich appointed Vice President of Operations
RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced today it is teaming with Ember Corporation to introduce ZigBee front end modules (FEMs) for smart grid applications that give utilities and consumers more control over how they monitor and save energy.
Sumitomo Electric Industries, Ltd., a provider of optical components and modules, and Anritsu Company, a global leader in optical test solutions, will be conducting a joint 40Gb/s technology demonstration in Anritsu’s booth – #3140 – during OFC/NFOEC 2010.
Inphi Corporation, a high-speed analog semiconductor company, today introduced its 4336TA Transimpedance Amplifier (TIA) for next-generation Small Form-Factor 40 Gbps Very Short Reach (VSR) transponder modules.
AIXTRON AG today announced an order from its long-time customer, Fraunhofer Institute for Applied Solid State Physics (IAF) located in Freiburg, Germany. IAF has ordered one AIX 2800G4 HT, 11x4 inch MOCVD tool which it will be using for GaN on SiC for high power, high frequency applications to enable commercialization of GaN devices in the near future.