< Page of 83 >

Technical Insights


Tuesday 27th June 2006
Atomic force microscopy is the standard technique for determining semiconductor surface roughnesses. But there is an easier-to-use alternative, white-light interferometry, which can deliver the same height resolution while imaging larger areas at far faster rates, argues IQE's Roy Blunt.
Tuesday 27th June 2006
Nichia has developed ultraviolet, blue and aquamarine high-power laser diodes that offer compact replacements for mercury lamps and argon-ion lasers and have the same structure as its 405 nm emitters. Richard Stevenson reports.
Tuesday 27th June 2006
The most upbeat mood in years was in evidence at this year's CS Mantech, with delegates as well as exhibitors feeling the benefits of surging sales of the latest phones. Richard Stevenson reports.
Tuesday 27th June 2006
Arrays of filter-free AlGaN-on-sapphire detectors that are unaffected by sunlight and deliver high sensitivity, high operability and excellent uniformity could be used in all sorts of commercial and military applications, say Marion Reine, Philip Lamarre and Allen Hairston from BAE Systems.
Tuesday 27th June 2006
The availability of 2 inch aluminum nitride substrates and the development of an LED that is based on doped epilayers of the same material marks the dawn of a new era in III-N technology, writes Michael Hatcher.
Wednesday 24th May 2006
Despite improving markets, massive chip vendor consolidation is imminent - and vital to sustain innovation, says Bookham's Giorgio Anania.
Wednesday 24th May 2006
The merger between telecom system giants Lucent Technologies and Alcatel will affect the supply chain all the way down to the III-V component level and play into the hands of broad-based suppliers, as Michael Hatcher reports.
Wednesday 24th May 2006
Fiber laser specialist and semiconductor fab owner IPG Photonics is building a second chip facility as demand for its high-power systems hots up.
Wednesday 24th May 2006
Infinera's Jagdeep Singh tells Richard Stevenson how his digital vision has beaten the skeptics and is revolutionizing optical networks.
Wednesday 24th May 2006
Infineon's new second-generation SiC diodes combine the established advantages of the Schottky structure with the better high-voltage characteristics and surge-current handling of a p-n junction. The result is a more rugged product that is better suited to medium- and high-power applications, say Kerstin Hubel and Markus Hallenberger.
Wednesday 24th May 2006
LED performance could be improved by switching production to GaN substrates, which reduces dislocation densities. However, a better solution is to combine HVPE and MOVPE into a single process, says researcher Glenn Solomon.
Wednesday 24th May 2006
nLight is aggressively targeting medical applications, displays, eye-safe communication and atmospheric sensing by extending the wavelength range of its high-power diode bars. Richard Stevenson reports on 660 nm and 1.9 µm emitters that feature record output powers.
Thursday 20th April 2006
Wafer-level integration of InGaP HBT and PHEMT structures is at the heart of Anadigics' strategy to return to profitability, hears Michael Hatcher.
Thursday 20th April 2006
Massive trading volumes and a rapid upturn in the valuations of Finisar and Avanex coincided with the year's biggest fiber-optic components show.
Thursday 20th April 2006
Dealing with a legacy of material quality problems, management issues and a plunge in market share doesn't sound like most people's idea of fun, but that didn't stop Phil Yin taking over the reins at substrate supplier AXT
Thursday 20th April 2006
The standard growth process for silicon carbide produces high-blocking-voltage devices, but suffers from long processing times. These delays are hindering commercialization, says Francesco La Via, who believes that the problem can be overcome by adding hydrogen chloride into the cell.
Thursday 20th April 2006
Michael Hatcher reports on a flurry of recent development activity in III-N materials that has seen numerous funding deals and the commercial shipment of AlN substrates.
Thursday 20th April 2006
High-performance traveling-wave amplifiers for oscilloscopes, radar and phased-array equipment can be made cheaper and simpler by switching to custom-built designs, claim Mark Kelly and Thorsten Brabetz.
Thursday 20th April 2006
Project management specialist Tal Levanon reveals how a new analysis tool can reduce cleanroom expansion costs at a semiconductor wafer fab by 25%.
Thursday 20th April 2006
MaxMile Technologies has launched the first non-destructive electroluminescence mapper for unprocessed LED epiwafers. The tool is claimed to offer quick feedback that can speed LED development and improve quality control. Richard Stevenson investigates.
Thursday 20th April 2006
The manufacturers of high-brightness LEDs and their customers in the general lighting industry now seem to be on the same wavelength, discovers Michael Hatcher.
Monday 13th March 2006
Get ready for a wave of innovation to impact on the industrial sector, says JDSU's Toby Strite.
Monday 13th March 2006
Michael Hatcher hopes that Freescale's GaAs MOSFET development proves more fruitful than Motorola's attempt to bring together silicon and III-V technology.
Monday 13th March 2006
Analyst raises Emcore's target price by 33% as the fiber-optic market bounces back to form and the commercial production of triple-junction solar cells for terrestrial applications begins in earnest.

×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
Live Event