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Tuesday 13th July 2010
The projects will focus on developing SiC chargers for electric vehicles, power transformers for grid scale applications and MW electrical power conversion for precise control of the electricity infrastructure.
Tuesday 13th July 2010
The firm will immediately support the Aluminium Nitride (AlN) market by utilizing the SFI Endeavor AT PVD platform to produce piezoelectric AlN films on 4" to 6" wafers.
Tuesday 13th July 2010
The RF5365 FEM integrates a 802.11b/g power amplifier with a single pole three throw (SP3T) switch for 2.4 GHz to 2.5 Ghz ISM band applications.
Tuesday 13th July 2010
The III-V CPV system provider for utility-scale solar power plants is preparing for growth in the U.S. with a new office, additional staff and CEC listing.
Tuesday 13th July 2010
The EVG520IS semi-automated wafer bonding system and EVG620TB mask and bond aligner will be employed for MEMS-related as well as photonics and optoelectronics research.
Tuesday 13th July 2010
The JVX7200 platform provides information on strain, composition, and thickness for SiGe stacks for sub 45 nm technology nodes
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Tuesday 13th July 2010
The new research partners will focus on the development of GaN-on-Si process and equipment technologies for solid state lighting and next-generation power electronics components.
Tuesday 13th July 2010
The former skilled operator opened fire inside the South East Albuquerque Emcore facility, killing two employees and injuring four others before turning the gun on himself.
Tuesday 13th July 2010
The company intends to use the proceeds from the offering to repay certain of its existing notes including redemption calls, open market purchases and privately negotiated transactions
Monday 12th July 2010
SAFE $8 million project's goal is aimed at revolutionizing front-end technology platforms for mobile handsets and media devices.
Monday 12th July 2010
SMX Measurement System provides a production-ready suite of thin film thickness and composition measurement.
Monday 12th July 2010
ContourGT-X8 PSS is specifically tailored for surface examination of Patterned Sapphire Substrates (PSS)
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Monday 12th July 2010
The SKY77706 LTE PA module, designed for multiple handset and data card applications product, will power Samsung's High Speed 4G USB Modem.
Monday 12th July 2010
The EVG560HBL multi-substrate wafer bonder significantly increases throughput for volume HB-LED production.
Monday 12th July 2010
The firme will announce its financial results for the second quarter 2010 in a press release immediately following the close of market on July 29, 2010.
Friday 9th July 2010
Four Bath University Engineering graduates show they are first class students when it comes to optoelectronics.
Friday 9th July 2010
Strategy Analytics report shows that a strong rebound in the second half of 2009 has driven volumes up 10% Year-on-Year.
Thursday 8th July 2010
The two firms have signed a worldwide patent cross-license agreement designed to further accelerate the growth of the LED lighting market.
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Thursday 8th July 2010
Green laser diode claimed to have a lifetime of 10,000 hours
Thursday 8th July 2010
The 4-Watt fiber-coupled Laser Diodes (LDs) are high-powered and low-cost and suited to medical and military applications
Thursday 8th July 2010
IQE plc has published a joint paper in Electronic Letters entitled "40 Gbit/s error-free operation of an oxide-confined 850nm Vertical Cavity Surface Emitting Laser (VCSEL)
Thursday 8th July 2010
Strathclyde has secured a spin-out deal to form a company working in the field of novel next-generation light source technology, which could open up a range of opportunities in multi-billion dollar applications including neuroscience, microscopy and communications.
Thursday 8th July 2010
Abound Solar Offered $400 Million Conditional Commitment for Loan Guarantee by U.S. Department of Energy
Thursday 8th July 2010
EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, have announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility.

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