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Friday 27th April 2007
US start-up Semprius gains early-stage backing to develop its novel transfer printing approach to chip manufacturing.
Friday 27th April 2007
The diversified approach pays off at TriQuint, securing a new top-five handset deal and improving performance in its network and military divisions, compensating for lower revenues from business with beleaguered Motorola.
Friday 27th April 2007
With potential orders for terrestrial solar power systems worth more than $300 million in the pipeline, Emcore is adding two production MOCVD systems at its Albuquerque facility.
Thursday 26th April 2007
Six new television models from market-leader Samsung feature high-brightness LED chipsets made by Luminus Devices.
Thursday 26th April 2007
University researchers in San Diego demonstrate an environmentalist's dream - a solar-powered device that could turn carbon dioxide into fuel.
Thursday 26th April 2007
Asahi Glass touts a new fluorine-based insulating material for GaAs and GaN RF chips; Aixtron ships its one-thousandth epitaxy machine; IQE's RF division receives Northrop Grumman's highest supplier rating; Lamina Ceramics closes a $7 million funding round.
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Wednesday 25th April 2007
Rapidly increasing sales of MOCVD equipment for high-brightness LED manufacturing is the key as Veeco Instruments swings into the black.
Wednesday 25th April 2007
A five-fold increase in profit and record annual sales sees RF Micro Devices in a buoyant mood, despite caution over the immediate impact of problems at key customer Motorola.
Tuesday 24th April 2007
Laser maker Furukawa Electric sells its majority stake in the chip manufacturer Optical Communication Products to US-based module vendor Oplink.
Tuesday 24th April 2007
Researchers from Hitachi Cable tell compoundsemiconductor.net they have the technology to push back the current boundaries in GaN growth.
Monday 23rd April 2007
The US chip maker fights to improve its fortunes, with weak operating income, flat revenues and increased costs causing short-term pain for long-term gain.
Monday 23rd April 2007
Already reckoned to be the world's biggest volume manufacturer of semiconductor lasers, Sony readies for mass production of high-power devices used in high-definition DVD recorders.
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Monday 23rd April 2007
US laser systems manufacturer New Wave Research is taking its Japanese rival Laser Solutions to court in a bid to secure rights to supply UV laser scribing technology to the key Taiwanese market.
Thursday 19th April 2007
Takeover speculation surrounds the German deposition equipment provider as its share price soars, despite denials and tight lips all around.
Thursday 19th April 2007
JPSA introduces new 100mm sapphire wafer laser dicing system; SET develops the shortest-wavelength LEDs on the market; STS issues profit warning, enters cost reduction program.
Thursday 19th April 2007
Problems at Motorola's handset division result in a 25 percent sequential drop in unit shipments, while rival Nokia goes from strength to strength.
Tuesday 17th April 2007
University of Braunschweig completes installation of a Thomas Swan epitaxy reactor and CV profiler; Emcore buys video transport business Opticomm; SiGe appoints new president and CEO.
Tuesday 17th April 2007
The US-based multinational technology corporation outlines a rapid deployment of “chip stacking”, promising extension of Moore's Law and 40% efficiency improvements in SiGe based power amplifiers.
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Friday 13th April 2007
The US based developer and manufacturer of semiconductor epitaxial wafers completes the first phase of its plan to produce 100,000 6-inch InGaP wafers per year by 2009.
Thursday 12th April 2007
The US optoelectronics manufacturer secures a further round of private capital to expand its busy optical transceiver production facilities.
Wednesday 11th April 2007
Samsung buys two more MOCVD systems; Emcore is allowed to remain listed on the Nasdaq exchange; Rohm and Haas Electronic Materials licenses future semiconductor materials technology; and The Fox Group appoints an exclusive distributor of its UV and blue LEDs in France.
Wednesday 11th April 2007
The Los Angeles based research company announces the first GaN MMIC for high-power, low-noise amplification in the W-band.
Tuesday 10th April 2007
Modeling by an independent firm suggests that using remote plasma CVD to deposit GaN LED structures on glass substrates will cut epiwafer production costs by 48 percent and the cost of individual LEDs by 10 percent.
Tuesday 10th April 2007
The Japanese LED manufacturer is continuing legal attempts to turn out the lights on potential patent infringers.

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