< Page of 83 >

Technical Insights


Tuesday 10th September 2002
As the demand for chip-level integration increases, the ability to successfully bond a range of materials onto a wafer is key. Shari Farrens, Viorel Dragoi, Paul Lindner and Bernhard Wieder report on the various wafer-bonding techniques that are available to chip manufacturers.
Tuesday 10th September 2002
The industry's largest event moves to San Jose, emphasizing manufacturing solutions for all types of III-V and silicon heterostructure devices. Marie Meyer previews CS-MAX 2002.
Tuesday 10th September 2002
While GaAs and SiGe are the obvious choices for manufacturing devices for 5-6 GHz WLANs, lower noise figures achieved through the control of parasitics are keeping CMOS in the frame.
Tuesday 13th August 2002
The latest OIDA workshop challenged all players in the photonics industry to develop a roadmap to guide the industry to the next stage of manufacturing maturity, reports Richard Dixon from Photonics Manufacturing, a workshop held at Boston University.
Tuesday 13th August 2002
VSK Photonics, a start-up fiber-optic component manufacturer, took less than five months to build its InP wafer fab, and the project came in under budget, write John Lungo and Ramin Rofagha.
Tuesday 13th August 2002
New materials, high-performance devices and next-generation technologies were all covered at IPRM 2002. Colombo Bolognesi reports on a show that provided delegates with a glimpse of what the future holds for InP.
Tuesday 13th August 2002
MOVPE may be a mature technology that is widely used in manufacturing, but nitrides and optical monitoring provoked much of the discussion at this year's IC-MOVPE, writes Jon Newey.
Tuesday 13th August 2002
The ability to assemble and solder thousands of individual chips simultaneously into a circuit may spell the beginning of the end for the pick-and-place assembly of components.
Tuesday 9th July 2002
Compound semiconductor materials are ideally suited for the development of spintronic devices thanks to the ability to epitaxially grow ferromagnetic metals on their surfaces.
Tuesday 9th July 2002
Business conditions might have been difficult lately, but as Jon Newey discovered at GaAs Mantech, the GaAs industry is busy developing new technologies and business plans to address the market as growth returns.
Tuesday 9th July 2002
Low-resistance metal interconnects and spin-on low-k dielectric materials such as BCB have been widely used in GaAs IC manufacturing, writes Philip Garrou of Dow Chemical.
Tuesday 9th July 2002
As the market continues to demand lower cost optical communications, component makers are turning to integration. Streamlined bonding and alignment will bridge the gap between discrete and integrated components write Robert Green and Stuart Morgan of Bookham Technology.
Tuesday 9th July 2002
The European Union has allocated a multimillion-dollar budget to help researchers develop wide-bandgap semiconductors that can meet the needs of tomorrow's electronic and optoelectronic devices. Rebecca Pool talks to some of the researchers that are tackling these issues.
Tuesday 9th July 2002
The lack of a native substrate has led to a variety of choices for those developing GaN-based devices. Jon Newey looks at what is currently in use and what the future developments might be in this fast-moving area.
Tuesday 9th July 2002
A consortium of companies and universities in Japan is developing efficient white LEDs and fixtures for solid-state lighting applications. Richard Dixon reports on the Light for the 21st Century project, a national program, with the overall aim of reducing energy consumption and contributing to Japan's 1997 commitment to lower greenhouse gas emissions.
Tuesday 9th July 2002
The National Compound Semiconductor Roadmap is an online resource from the Office of Naval Research that aims to accelerate compound semiconductor research, reports Richard Dixon.
Wednesday 5th June 2002
LDMOS transistors with a power density of more than 2 W/mm at 1 GHz and 70 V will compete very effectively with more expensive GaN-on-SiC devices for base-station power amplifiers.
Wednesday 5th June 2002
As a result of a strategic partnership between Raytheon RF Components and WIN Semiconductors Corp, the two companies are now able to manufacture drop-in replacement GaAs HBT MMICs for handset power amplifier modules. According to Dennis Williams and colleagues, the chips are equivalent to established Raytheon products in terms of dimensions, topography and performance, rendering the once-sacred microwave MMIC just another line item on the assembly bill of materials.
Wednesday 5th June 2002
Reflectance anisotropy spectroscopy has helped to improve the productivity of GaAs epitaxy. Elisabeth Steimetz and colleagues describe how it is now being applied to InP-based structures.
Wednesday 5th June 2002
Peter Velling and colleagues from IPAG describe how a quantitative X-ray analysis technique is being used in the fab to provide SPC for epilayers.
Wednesday 5th June 2002
Spectroscopic ellipsometers have become an integral part of many thin-film manufacturing processes, and can measure the properties of semiconductor epilayers with great accuracy, write Lianchao Sun, Jean-Claude Fouéré and Chris Pickering.
Friday 3rd May 2002
Backed by growing market interest and the availability of 4 inch substrates and epiwafers, several IC manufacturers are now developing products for 40 Gbit/s networks, writes Tim Whitaker.
Friday 3rd May 2002
Companies aiming to transfer indium phosphide technology from the lab to the fab can learn a great deal from the experiences of the GaAs industry, writes Velocium's Dwight Streit.
Friday 3rd May 2002
As demand increases for high-speed indium phosphide ICs in fiber-optic networks, wafer manufacturers must strive to keep pace. Rebecca Pool discovers some of the issues involved in supplying high-quality InP substrates grown using different techniques.

×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
Live Event