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Technical Insights


Friday 3rd May 2002
With it becoming increasingly difficult and expensive to reduce the limits of lithography any further, researchers are now looking at new ways to shrink feature sizes.
Friday 3rd May 2002
Despite a lack of customers, there is a lot of activity at the component level of the fiber-optic market. Tim Whitaker and Richard Dixon report from the recent OFC conference in Anaheim, CA.
Friday 3rd May 2002
High-brightness LEDs continue to penetrate automotive, displays, signage and decorative lighting markets, says Richard Dixon in the second of two reports from the recent Strategies in Light conference.
Friday 3rd May 2002
Scott Jennato, Joe Jablonski and Don Feuerstein look at a new approach to VCSEL testing that promises to increase wafer yields, cut manufacturing costs and reduce time to market.
Wednesday 3rd April 2002
TriQuint has virtually completed the conversion of its fab in Oregon to 6 inch wafers, and also has a 6 inch wafer fab in Texas standing ready for the market upswing, writes Tim Whitaker.
Wednesday 3rd April 2002
The wireless handset industry is poised to recover from its slump in 2001 as subscribers buy replacement handsets with new features and services, writes Tim Whitaker.
Wednesday 3rd April 2002
Xindium Technologies is using research results published by the University of Illinois at Urbana-Champaign to build high-speed, low-power indium phosphide ICs, writes Tim Whitaker.
Wednesday 3rd April 2002
The popularity of InGaP HBTs is growing and MOCVD seems to have cornered the market for InGaP HBT epiwafers. Jon Newey looks at the reasons for its success so far and speaks to various MBE companies to find out why they think they can win themselves a bigger slice of the InGaP pie.
Wednesday 3rd April 2002
Once dominated by large industrial conglomerates, the compound semiconductor industry in Korea now has many much smaller start-ups, write Tim Whitaker and Bridget Adams.
Wednesday 3rd April 2002
Driven by automotive and backlighting applications, the market for high-brightness LEDs looks set to grow by about 10% in 2002. Richard Dixon reports from the Strategies in Light conference.
Wednesday 3rd April 2002
VCSELs are still developing quickly despite the challenges of manufacturing large arrays and the reliability of the materials used in long-wavelength lasers for optical networking, as Richard Dixon discovered at the recent Photonics West conference in San Jose, California.
Thursday 7th March 2002
Iain Calder describes how characterization equipment is being integrated into the process flow to provide increased measurement reliability, low cost and rapid turnaround.
Thursday 7th March 2002
Component makers that incorporate automation into their manufacturing strategies are likely to emerge as market leaders as the industry matures, writes Charlie Duncheon of Adept Technology.
Thursday 7th March 2002
Lithium niobate is a well established modulator technology, but it is seeing some stiff competition from alternatives in the compound semiconductor industry, writes Jon Newey.
Thursday 7th March 2002
Two-dimensional VCSEL arrays offer the next step forward in bandwidth for parallel optical transceivers, according to Martin Grabherr and colleagues from ULM Photonics.
Thursday 7th March 2002
The demand for high-bandwidth optical interconnects has prompted companies such as TeraConnect to make modules with 2D arrays of VCSELs and detectors, writes Tim Whitaker.
Thursday 7th March 2002
Wouter Deelman and Chrétien Herben look at how indium phosphide is answering the call for cheaper and more compact components for optical communication networks.
Wednesday 6th February 2002
While SiGe bipolar work often grabs the headlines at IEDM, the most significant and exciting results reported at this year's annual device showcase were those relating to CMOS devices.
Wednesday 6th February 2002
Manufacturers of high-brightness LEDs continue to make significant advances in the output power of nitride-based emitters, targeting a range of applications, writes Richard Dixon.
Wednesday 6th February 2002
The combination of wafer bonding using metal layers and the introduction of buried micro-reflector structures leads to thin and highly efficient AlGaInP LEDs that can be manufactured on 4 inch wafers, according to Stefan Illek and co-workers at Osram Opto Semiconductors.
Wednesday 6th February 2002
Improvements in package design are expected to extend the lifetime of LED-based lighting fixtures towards 100,000 hours, according to Nadarajah Narendran and Keith Toomey.

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