EVG's EZR (Edge Zone Release) and EZD (Edge Zone Debond) modules enable a flexible choice of adhesives for bonding compound semiconductor materials and can be easily integrated in EVG's high-volume manufacturing equipment platforms.
Strategy Analytics’ latest report says that 6-inch GaAs epitaxial substrates will be the most prevalent, accounting for slightly more than 80 percent of total device demand over the 2010 to 2015 period.
III-V revenues were affected by a shift in wireless handset sales as various OEMs are adjusting their product offering dates from a pattern which focused on the U.S. holiday season to more year- round introductions of handsets and tablets.
The firm was acknowledged as a prominent leader in the compound semiconductor industry and for offering guidance and innovations that increase organisational efficiencies, returns, and accomplishments.
The worldwide mobile phone market grew 12.8% year over year in the third quarter of 2011 (3Q11), as smartphone growth declined in key mature markets. According to the International Data Corporation (IDC) Worldwide Mobile Phone Tracker, vendors shipped 393.7 million units in 3Q11 compared to 348.9 million units in the third quarter of 2010. However, the 12.8% growth was higher than IDC's forecast of 9.3% for the quarter and stronger than the 9.8% growth in 2Q11.