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Thursday 13th November 2003
Tegal has added another processing technology to its product line, giving it access to a market with good growth potential.
Thursday 13th November 2003
As Emcore prepares to move out the MOCVD systems business, its revenues are starting to rise and the company is forecasting to make an operating profit in 2004.
Thursday 13th November 2003
AmberWave is now able to grant sublicenses for strained Si technology owned by Agere.
Tuesday 11th November 2003
Mimix Broadband has won the confidence of investors, adding to its balance sheet and board room.
Tuesday 11th November 2003
Norlux is fighting back after a difficult time thanks to the efforts of its founders John DiNardi and Doug Hamilton.
Friday 7th November 2003
The MOCVD equipment manufacturer posts a pre-tax loss of €2.5 million, but says that new orders are on the up.
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Friday 7th November 2003
Nanosemiconductor specializes in wafers for quantum-dot lasers and metamorphic microelectronic devices.
Friday 7th November 2003
Spire Corporation faces possible Nasdaq de-listing, Sirenza is awarded a broadband amplifier patent and receives a fresh ISO 9001:2000 certification, while United Monolithic Semiconductors forms a ‘strategic alliance’ with TNO-FEL.
Tuesday 4th November 2003
Emcore, which began life nearly 20 years ago as an MOCVD equipment supplier, has sold its MOCVD business to Veeco in order to concentrate on its optical communications products business.
Tuesday 4th November 2003
US company challenges Hitachi with a new range of red semiconductor lasers emitting at 635nm.
Tuesday 4th November 2003
Avanex’s revenue figures took a jump in the September quarter as contributions from its newly acquired businesses began to flow in.
Monday 3rd November 2003
SiC-based MEMS manufacturer FLX Micro has closed an additional round of venture financing.
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Monday 3rd November 2003
Equipment manufacturer EV Group and substrate developer SiGen have formed a partnership to develop low-temperature wafer bonding technologies.
Monday 3rd November 2003
Funding will accelerate the development of high-power diode lasers.
Monday 3rd November 2003
Trikon has reported its quarterly results, Accent and Bede have made new appointments and Intense Photonics has won an R&D contract.
Monday 3rd November 2003
VPEC, a Taiwanese epiwafer supplier, has started to ship wafer-bonded (WB)-LED chips to domestic LED packaging manufacturers.
Friday 31st October 2003
IBM has expanded its device foundry services to include CMOS and SiGe technologies designed for the production of wireless chips.
Friday 31st October 2003
Skyworks took on some hefty restructuring charges in the September quarter, while its revenues remained unchanged over the previous quarter.
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Friday 31st October 2003
Japanese LED manufacturer Nichia has been awarded a preliminary injunction order against Everlight, a Taiwanese LED packaging company.
Thursday 30th October 2003
Spire has received a US patent on a method for implanting aluminum oxide in GaAs and other III-V semiconductor wafers for isolation of integrated circuit lasers and optical waveguides.
Wednesday 29th October 2003
In a departure from its previous business model, Cree has announced that it is to begin offering packaged LEDs.
Wednesday 29th October 2003
Another company has joined the race to develop and commercialize light emitting devices based on silicon.
Tuesday 28th October 2003
With the company closing both its Ottawa and Milton facilities, cash burn rose to £22.9 million in Bookham’s latest financial quarter.
Monday 27th October 2003
Ian Smith, CEO of equipment supplier STS, has resigned and will be replaced by an executive from Sumitomo Precision Products, which owns the majority of shares in STS.

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