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Tuesday 8th April 2003
Financials from Riber and RFMD, Celeritek calls a special meeting of shareholders, and Ommic gains ISO certification
Thursday 3rd April 2003
It's all change at Finisar as the company acquires Genoa and relocates its Demeter business.
Wednesday 2nd April 2003
Anadigics hopes to accelerate the penetration of HBT-based power amplifiers and modules into the wireless LAN market with the purchase of certain product lines from RF Solutions.
Tuesday 1st April 2003
Soitec, a French manufacturer of silicon-on-insulator (SOI) wafers, has purchased selected assets from French epiwafer supplier Picogiga.
Tuesday 1st April 2003
Sumitomo, which sells Cree's LED chips to Japanese packaging customers, has signed a commitment to purchase $100 million of chips during Cree's fiscal year 2004.
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Friday 28th March 2003
Despite recording a 45% year-on-year drop in revenues during 2002, epiwafer supplier IQE sees evidence of a sustainable upturn in its wireless business.
Thursday 27th March 2003
Oki Electric Industry Co., Ltd. has announced a AlGaN/GaN HEMT power transistor with dramatically improved amplification characteristics for wireless communications applications.
Thursday 27th March 2003
A new W-CDMA power amplifier module from Celeritek is the first such part that does not contain passive components.
Wednesday 26th March 2003
Endwave is supplying wireless transceiver modules to Seimens, Celeritek is taking legal advice in response to shareholders demands and RFMD’s environmental practices have received ISO certification.
Tuesday 25th March 2003
Infineon looks like being the first company to have refined its long wavelength VCSEL technology to the point where it can begin high-volume manufacturing of products
Tuesday 25th March 2003
Mitsubishi Electric in the USA is to bring all of its optoelectronic and microwave/RF activities into a new semiconductor division headquartered in Silicon Valley
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Monday 24th March 2003
A new £4.2 million ($6.75 million) facility is to be established in Scotland to commercialize research in the growing technology of packaging complex optoelectronic chips.
Monday 24th March 2003
Worldwide handset sales totaled 423.4 million units in 2002, a 6 percent increase from 2001, according to Dataquest, a unit of Gartner.
Monday 24th March 2003
TriQuint Semiconductor has announced multiple new products and product family expansions, as well as a capacity expansion in its Matamoros, Mexico manufacturing facility.
Thursday 20th March 2003
Singapore-based DenseLight has opened a US office and Anadigics and Optillion have met the requirements for ISO 9001:2000 certification.
Thursday 20th March 2003
The ongoing consolidation in the fiber-optic components industry has not gone far enough into the 1310 nm transceiver industry, says Strategies Unlimited.
Tuesday 18th March 2003
Zia Laser has taken the option of leasing lab space from Emcore for the continued development of its quantum dot laser products, rather than expanding its own facilities in a time of uncertainty for optical component manufacturers.
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Monday 17th March 2003
At the Optical Fiber Communication Conference and Exposition (OFC), March 25-28, Bookham will be reporting some impressive technical achievements that we can expect to see incorporated into its products in the near future.
Monday 17th March 2003
MetroPhotonics has become the first optical component vendor to manufacture photonic ICs on 4 inch InP substrates, Soitec is making a push into China and AWR has a new VP of marketing.
Monday 17th March 2003
Veeco has opened a new facility for MBE process development and has also opened a sales and customer support office in Shanghai.
Monday 17th March 2003
VCSEL pioneer Picolight has extended its product range and begun a manufacturing partnership with Pemstar to better meet the expected demand for its products.
Monday 17th March 2003
Sirenza is aiming to challenge the emergence of GaN for high-power applications by using Si LDMOS-type devices fabricated on SiC substrates.
Thursday 6th March 2003
Later this month at the Optical Fiber Communication conference (OFC), Bookham Technology will introduce a novel in-situ etch and regrowth process for uncooled InP buried-heterostructure lasers that results in 50% lower rates of burn-in degradation than can be obtained by current standard processes.

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