Loading...
News Article

Silvaco joins 'GaN Valley'

News

EDA firm joins wide bandgap semiconductor innovation ecosystem in Europe

EDA firm Silvaco has joined GaN Valley, a technology hub in Europe targeting the growing industry for GaN-based electronic systems that are more efficient, smaller, lighter, and lower cost.

“Silvaco has a long history of developing TCAD technologies targeting GaN semiconductor process and device innovations with its Victory TCAD platform,” said Eric Guichard, SVP and GM of TCAD Business Unit at Silvaco. “By joining GaN Valley we will share know-how and collaborate with leading research teams within the GaN Valley members to bring new innovative solutions to the design community and help build a strong ecosystem for designing GaN-based semiconductors.”

“With rapidly evolving GaN technology and an expected $2B market by 2027, GaN is taking its place in the power semiconductor market,” said Marnix Tack, co-founder of GaN Valley and CTO of BelGaN Foundry. “GaN Valley is a new and unique ecosystem developing in Europe, currently having close to 60 members active along the GaN value chain in Europe. Through connecting and collaboration, GaN Valley will accelerate innovation and business development of a GaN-based industry in Europe and beyond.”

MoD to put £200m into UK compound semi fab
EU invests €15M to help firms use photonics
ST and Innoscience sign GaN deal
Lumentum shows InP advances at OFC
A step towards higher DUV LED efficiency
Quantum Science achieves ISO 9001:2015 certification
Ascent wins order for power-beaming module
Navitas Partners with Great Wall for 400V-DC power
SemiQ supplies SiC MOSFET modules for EV battery cell cyclers
Coherent and Keysight collaborate on 200G/lane multimode VCSEL tech
Lumentum and Marvell exhibit integrated 450G optical interface
Marktech announces new MWIR LEDS
Imec identifies stable range for GaN MISHEMTs in RF PAs
Polar Light completes $3.4m funding round
Lynred launches advanced thermal imaging modules
Altum RF expands Sydney design centre
Sivers announces partnership with O-Net
Ayar Labs unveils first UCIe optical chiplet
Aixtron delivers InP tool to Nokia
WHU-USTC team demo novel GaN chip temperature monitoring
Phlux lands £9m to take InGaAs sensors to next level
4-inch gallium oxide facility established in Swansea
Mazda and Rohm collaborate on automotive GaN
University of South Carolina chooses MOCVD tool from TNSC
Wolfspeed appoints new CEO amidst funding crisis
SiC slowdown is only short term, says Yole
Pragmatic launches flexible IGZO-based NFC chip
Poet ships latest optical engine samples
EU project to develop 1200V DC powertrain
£250m to turbocharge Welsh compound semi cluster
Scientists harness phonon-polariton electroluminescence
TU Graz team reveals the secrets of heat conduction
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: