Loading...
News Article

A step towards higher DUV LED efficiency

News
WHU team achieves high power and ultra low voltage in AlGaN DUV emitters using polarised tunnelling junction

Researchers from Wuhan University in China have developed ultrathin tunnelling junction (PUTJ) technology to address long-standing challenges in DUV LEDs, achieving a record-low operating voltage of 5.8 V at 30 A/cm² and a 40 percent enhancement in light output power (LOP).

The team says this result, which uses polarisation-engineered AlGaN heterostructures to improve carrier tunnelling and current spreading, marks a significant step toward high-efficiency DUV light sources for sterilisation, sensing, and medical applications.

“By reducing the TJ thickness and strategically modulating the Al content in the interlayer, we achieved dual optimisation of vertical tunnelling efficiency and current spreading. The polarised electric field at the heterointerfaces narrows the depletion region, boosting tunnelling probability by 1.5× compared to UTJ, and the higher resistance of the interlayer improves current spreading across large-area devices.” said Shengjun Zhou, who directed the research.

DUV LEDs face critical bottlenecks in commercial adoption, including optical losses from p-GaN absorption and high operating voltages due to poor hole injection in high-Al-content AlGaN. Conventional TJs mitigate absorption but suffer from thick n-AlGaN current-spreading layers that increase bulk resistance.

To address these issues, the researchers proposed an innovative configuration including a 20-nm-thick p⁺/n⁺ Al0.55Ga0.45N homojunction and a 2 nm intrinsic Al0.65Ga0.35N interlayer, which harnesses polarisation-induced electric fields to enhance interband tunnelling while maintaining optical transparency.

The researchers further validated the mechanism through TCAD simulations, revealing that the Al0.65Ga0.35N interlayer increases polarisation-induced electric field strength by 20 percent in the tunnelling region, while increasing lateral hole concentration contribution.

This dual effect ensures efficient carrier injection and uniform radiative recombination across multiple quantum wells. The PUTJ platform bridges the gap between optical transparency and electrical efficiency in III-nitride optoelectronics.

Future work will focus on integrating this design into microscale devices and cascaded multi-junction architectures to further push the limits of DUV light sources.

Reference

'AlGaN Polarised Ultrathin Tunnelling Junction Deep Ultraviolet Light-Emitting Diodes' by Ziqi Zhang et al; Nano Letters 2025, 25(4)

Tariff uncertainty weighs on displays
Flexible perovskite/CIGS tech reaches 23.64% efficiency
IQE and X-FAB sign GaN power collaboration
Riber reports solid growth in sales and earnings
How to make green ZnSeTe QD-LEDs brighter
Korean team makes novel flexible ammonia sensor
Optimising green LEDs for near-eye applications
MoD to put £200m into UK compound semi fab
EU invests €15M to help firms use photonics
ST and Innoscience sign GaN deal
Lumentum shows InP advances at OFC
A step towards higher DUV LED efficiency
Quantum Science achieves ISO 9001:2015 certification
Ascent wins order for power-beaming module
Navitas Partners with Great Wall for 400V-DC power
SemiQ supplies SiC MOSFET modules for EV battery cell cyclers
Coherent and Keysight collaborate on 200G/lane multimode VCSEL tech
Lumentum and Marvell exhibit integrated 450G optical interface
Marktech announces new MWIR LEDS
Imec identifies stable range for GaN MISHEMTs in RF PAs
Polar Light completes $3.4m funding round
Lynred launches advanced thermal imaging modules
Altum RF expands Sydney design centre
Sivers announces partnership with O-Net
Ayar Labs unveils first UCIe optical chiplet
Aixtron delivers InP tool to Nokia
WHU-USTC team demo novel GaN chip temperature monitoring
Phlux lands £9m to take InGaAs sensors to next level
4-inch gallium oxide facility established in Swansea
Mazda and Rohm collaborate on automotive GaN
University of South Carolina chooses MOCVD tool from TNSC
Wolfspeed appoints new CEO amidst funding crisis
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
x
Adblocker Detected
Please consider unblocking adverts on this website