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Onsemi EliteSiC MOSFETs now in T2PAK

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Top-cool package delivers superior thermal performance, reliability, and design flexibility

Onsemi has released its 650V and 950V EliteSiC MOSFETs in the industry-standard T2PAK top-cool package, advancing power packaging for automotive and industrial applications.

According to the company, this new offering delivers enhanced thermal performance, reliability and design flexibility for demanding high-power, high-voltage applications for markets including electric vehicles, solar infrastructure, and energy storage systems.

The T2PAK’s top-cool package is designed to deliver an optimal balance of heat dissipation and switching performance by enabling direct thermal coupling between the MOSFET and the application heatsink. This design minimises junction-to-heatsink thermal resistance and supports a wide range of Rds(on) options (12mΩ to 60mΩ), providing enhanced design flexibility.

Initial devices are shipping to lead customers, with additional products planned for Q4 2025 and beyond.

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