Simplifying device testing from DC to 250GHz
Keysight Technologies has collaborated with the University of Glasgow, the National Physical Laboratory (NPL), and MPI to develop a new approach to broadband characterisation of next-generation sub-terahertz (sub-THz) semiconductor devices.
Together, the organisations demonstrated continuous on-wafer characterisation of InP HEMTs from near DC to 250 GHz in a single sweep, simplifying broadband measurements for advanced semiconductor research and design.
As semiconductor technologies move into mmWave and sub-terahertz frequencies for next-generation applications, engineers need to accurately characterise transistor performance across increasingly broad frequency ranges. Conventional approaches can require multiple measurement setups and calibrations, adding complexity and making it more difficult to obtain consistent data for broadband device modeling.
The four organisations combined Keysight instrumentation, University of Glasgow semiconductor devices, MPI Corporation on-wafer probing technology, and NPL metrology expertise to create the broadband measurement solution.
The Keysight tools included the PNA-X Vector network analyser; the Single-Sweep 250 GHz frequency extender; and its Precision Source/Measure Unit (SMU).
Together, these technologies enabled continuous measurement from near DC to 250 GHz with a single probe touchdown, eliminating the need for multiple setup changes and providing consistent broadband S-parameter measurements. Built-in source filtering and broadband source power calibration also helped ensure signal purity of the applied mmWave signal at the probe-tip.
Thierry Locquette, VP of sales, Europe, Middle East & Africa at Keysight said: “Characterising devices continuously from near DC to 250 GHz in a single sweep can significantly simplify the measurement process for researchers developing next-generation semiconductor technologies. By bringing together expertise in instrumentation, devices, probing, and metrology, this collaboration demonstrates a practical approach to generating the consistent broadband data engineers need to accelerate device development.”
Xiaobang Shang, principal scientist and On-wafer Measurement Lead at NPL, said: “Accurate on-wafer measurement is essential for developing reliable semiconductor devices, particularly as technologies move further into the millimetre-wave and sub-terahertz frequency ranges. We were pleased to contribute NPL’s high-frequency on-wafer metrology and calibration expertise to this collaboration, helping demonstrate a practical route to consistent broadband device measurements using the state-of-the-art single sweep system.”
Matthew White, director of Business Development at MPI, said: “Extending on-wafer characterisation to 250 GHz requires the probing, calibration, and measurement platform operating as one seamlessly integrated system. This collaboration demonstrates a practical approach to achieving consistent broadband measurements from near DC to 250 GHz with a single probe touchdown, helping researchers simplify characterisation and accelerate device development with great confidence.”
