Avicena to demo 'connectorised' µLED interconnect at ECOC 2026
Avicena, a US developer of microLED-based optical interconnects, will demonstrate the industry’s first connectorised microLED optical interconnect at ECOC 2026 taking place September 21–23 at the Palacio de Ferias y Congresos de Málaga in Málaga, Spain.
The new LightBundle eKit implementation combines Avicena’s laser-free microLED transceiver technology with an inline detachable optical interface, providing a practical path to assembling, testing, servicing, and upgrading optical connectivity in next-generation AI systems.
The announcement builds on Avicena’s recent shipment of 1 Tbps microLED optical interconnect evaluation kits. Those systems incorporate as many as 335 independent microLED data channels operating at up to 3 Gbps per channel coupled through Avicena’s multicore fibre technology to integrated photodetector arrays. The connector uses an industry standard MPO form factor combined with a ferrule optimised for multicore fibre bundles.
Marco Chisari,CEO of Avicena said: “Introducing the world’s first connectorised microLED optical interconnect marks an important step in moving microLED connectivity from breakthrough technology to a deployable platform for AI infrastructure. Following the shipment of our 1 Tbps LightBundle evaluation kits, we are now demonstrating how the same fundamental architecture can be implemented with the modularity and serviceability required by system manufacturers."
LightBundle replaces lasers with dense arrays of microLED transmitters coupled through multicore fibre to integrated photodetector arrays. Its wide-and-slow architecture distributes bandwidth across hundreds of low-power optical channels, enabling high aggregate throughput without requiring the extremely high per-lane speeds and complex signal processing associated with conventional optical links.
The new connectorised implementation adds the modularity required for practical system integration. A detachable optical interface can simplify system assembly, enable independent testing of electronic and optical subsystems, improve field serviceability, and support flexible routing between packages, boards, trays, and racks.
