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Thursday 23rd September 2010
The Taiwanese based firm has ordered six 55x2-inch Aixtron New Generation CRIUS II MOCVD growth tools to manufacture blue and green GaN LED wafers.
Thursday 23rd September 2010
The firm has recently signed a new distributor agreement with Midoriya Electric which distributes various electric and electronic products including semiconductors.
Thursday 23rd September 2010
The firm’s latest TQP15 technology will enable cost effective millimeter wave MMICs for use in applications such as VSAT, satellite communications and point to point radios.
Thursday 23rd September 2010
Existing Agilent customers and partners, including foundries and component vendors, are invited to join the ADS 2011 Early Access Program beginning next month.
Thursday 23rd September 2010
According to Research & Markets’ latest report, GaN and SiGe will overtake the GaAs MMIC sector while InP and InGaP demand in MMICs will dwindle.
Thursday 23rd September 2010
Anadigics’ high-performance InGaP AWC6323 device should meet the demand for increased integration in dual-band handsets.
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Thursday 23rd September 2010
The firm’s Acriche LEDs will be used at Oak Ridge Laboratories’ housing project. Data from house outfitted Acriche LEDs will be compared with that of a house using compact fluorescent lights to demonstrate LEDs’ efficiency.
Thursday 23rd September 2010
The new product expands Dow Corning's product line beyond its existing offerings of 76 mm SiC and 100 mm SiC epitaxial wafers for high power applications.
Thursday 23rd September 2010
King Abdullah University of Science and Technology has selected EVG wafer bonding and automated alignment systems on the strength of flexible technology, local service and support.
Wednesday 22nd September 2010
The highly integrated core chip has integrated transmit/receive switches, Low Noise Amplifier (LNA), 6-bit phase shifter, 5-bit attenuator and driver amplifier.
Wednesday 22nd September 2010
The firm will demonstrate the new optical test solutions at ECOC 2010, Sept. 20-22, Torino, Italy, Lingotto Fiere Exhibition Center, Hall 3, Booth #334.
Wednesday 22nd September 2010
The primary objective of the Phase 1 grant is to bring big-chip solid-state lighting solutions to world markets more rapidly and at lower costs with energy efficient electronics.
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Wednesday 22nd September 2010
The two firms have agreed to share specific technologies regarding III-V compound semiconductor light emitting diodes (“LEDs”), which include InGaN LEDs and AlGaInP LEDs.
Wednesday 22nd September 2010
The wholly owned subsidiary has introduced a family of AlGaAs/InGaAs low noise pHEMT devices with operational frequencies to 26GHz.
Wednesday 22nd September 2010
The 40G DQPSK market represents one of the fastest growing segments in optical communications.
Wednesday 22nd September 2010
The researchers have developed the necessary components needed to unlock the secrets of some of the world’s harshest environments. They are now working to integrate the modules into a device about the size of an iPhone.
Wednesday 22nd September 2010
The firm is the recipient of $5 Million in federal funding for its On-Chip integrated photonic polymer transceiver from the U.S. Senate Committee.
Wednesday 22nd September 2010
With low power consumption for next-generation TVs, the AS3695 16-channel LED driver ICs are claimed to enable the brightest and clearest TV picture and best 3D effects.
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Tuesday 21st September 2010
The new production line will be located in Cree’s current Research Triangle Park facility and will enable larger LED wafers, increasing output and production efficiency.
Tuesday 21st September 2010
The firm has raised its current quarter guidance to $310 million in revenue and $0.40 of non-GAAP diluted EPS.
Tuesday 21st September 2010
The integrated module capability enables programmable multi-service OTN switching throughout the network.
Tuesday 21st September 2010
The firm will showcase its latest range of products at the 36th European Conference and Exhibition on Optical Communications (ECOC) in Torino, Italy on September 20-22.
Tuesday 21st September 2010
The latest modules support the requirements of the OIF implementation agreement on 100G integrated polarization intradyne coherent receivers.
Tuesday 21st September 2010
The lots include mass flow control technology and the use of AlN in thin-film structures for oxidation protection and electrical insulation.

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