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Monday 10th January 2005
As three more companies join the Blu-ray bandwagon, Sony’s format looks to be first choice among developers of electronic games.
Friday 7th January 2005
Deep-UV LED manufacturer Sensor Electronic Technology looks to penetrate higher-volume markets with its AlInGaN devices.
Friday 7th January 2005
NEC says that it will deliver HD DVD drives in September 2005, while Warner Brothers will release the latest Batman film, due out this summer, on the new format.
Wednesday 5th January 2005
Japanese epiwafer supplier Sumika Electronic Materials bolsters the manufacturing lines at its Phoenix facility.
Tuesday 4th January 2005
More consolidation is on the way, as France-based fiber-optic component specialist Highwave plans to buy out Northlight Optronics, the Swedish manufacturer of InP-based transmitters and receivers.
Tuesday 4th January 2005
Super-bright LED array developer Lamina Ceramics says that thanks to the falling cost of chips, it can slash the prices on two product lines by more than half.
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Thursday 23rd December 2004
Demand for InP bulk substrates is set to remain low despite emerging applications, Jerry Woodall wins another gong, LayTec sells its 50th EpiTT sensor for LED production, and Sirenza seals an acquisition.
Wednesday 22nd December 2004
Fujitsu Laboratories says that its GaN HEMTs can now be manufactured on conductive SiC substrates, thereby cutting device production cost by two-thirds.
Monday 20th December 2004
Leading GaAs HBT manufacturer RF Micro Devices is to invest $75 million in a bid to increase production volumes.
Monday 20th December 2004
Fabless RFIC design house Comlent has developed what it claims to be the first complete RFIC transceiver sampled by a company based in mainland China.
Friday 17th December 2004
Reduced on-resistance and miniaturization are two of the benefits of GaN-based FETs that use a "source-via-grounding" technology, says Matsushita.
Wednesday 15th December 2004
GaAs chip manufacturer TriQuint Semiconductor is to acquire acoustic wave filter specialist TFR Technologies in a deal worth around $3 million.
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Monday 13th December 2004
A German collaboration has investigated the combustion processes occurring in a high-efficiency truck engine using a tunable VCSEL.
Monday 13th December 2004
Seoul Semiconductor has introduced a series of high-power packaged LEDs, including a full-color device containing high-power RGB chips.
Monday 13th December 2004
A high-profile team comprising IBM, Advanced Micro Devices, Sony and Toshiba has developed a way to implement strain in both n-channel and p-channel silicon transistors that avoids the use of SiGe epitaxy.
Friday 10th December 2004
UK-based IQE Silicon Compounds says that its strained silicon process significantly increases carrier mobilities in PMOS devices.
Friday 10th December 2004
With the Blu-ray Disc Association securing non-exclusive backing from Disney, the major Hollywood studios are split down the middle over next-generation DVD.
Friday 10th December 2004
Bookham Technology consolidates three San Jose facilities into one in its latest bid to cut costs.
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Friday 10th December 2004
Sirenza acquires ISG Broadband for $7 million, RFMD ships its millionth EDGE transceiver chipset, and Skyworks picks up a volume order for its CDMA2000 radios.
Thursday 9th December 2004
According to press reports in Japan, Sanyo Electric will spend nearly $100 million over the next two years to mass produce blue laser diodes and optical pick-ups.
Tuesday 7th December 2004
Chip giant IBM says that it has developed a technique for making fast strained-germanium transistors that is compatible with conventional CMOS processing.
Monday 6th December 2004
Mitsubishi Electric has licensed laser manufacturing technology from intellectual property specialist BTG, Chuck Milligan takes over as CEO of optics company Heptagon, RFMD ships more Polaris 2 transceivers to Motorola, and AXT finalizes its litigation settlement with Sumitomo Electric.
Friday 3rd December 2004
A team from Chalmers University of Technology, Sweden, has demonstrated an RF link with a multimode fiber and a VCSEL, an important step towards the development of next-generation wireless networks.
Friday 3rd December 2004
Strained silicon takes a big step towards industrial application with the development of 300 mm wafers suitable for future CMOS technology nodes.

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