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Tuesday 24th October 2023
Onsemi completes Korean SiC facility
Tuesday 24th October 2023
IEC white paper calls for power chip standards
Tuesday 24th October 2023
MBE for far-UV LEDs
Monday 23rd October 2023
Element Six joins US DoD LADDIS program
Monday 23rd October 2023
Tunnelling junction enhances deep UV LEDs
Monday 23rd October 2023
Quantum Science welcomes QD market report
Thursday 19th October 2023
Researchers develop new way to tailor-make thin films
Thursday 19th October 2023
GF awarded $35M to accelerate GaN plans
Thursday 19th October 2023
Automotive chips: 100B devices in 2028
Thursday 19th October 2023
Altum RF signs MEV Elektronik
Thursday 19th October 2023
PowiGaN gives Team aCentauri an edge in Solar Challenge
Wednesday 18th October 2023
Scientists grow Ga
2
O
3
films with MOVPE
Wednesday 18th October 2023
Hyundai, Kia and Infineon sign multi-year power semi deal
Tuesday 17th October 2023
J2 to build Hong Kong's first 8-inch SiC fab
Tuesday 17th October 2023
Trimming the on-resistance of GaN MOSFETs
Tuesday 17th October 2023
Innoscience signs up with MEV Elektronik
Tuesday 17th October 2023
MBE tool benefits from joint development
Monday 16th October 2023
Hercules E-band module takes off with need for speed
Thursday 12th October 2023
GaN Systems co-founder joins QPT
Wednesday 11th October 2023
Yuanjie Semiconductor to supply lasers to POET
Wednesday 11th October 2023
Transphorm’s TOLL FETs target AI applications
Tuesday 10th October 2023
Denso and Mitsubishi invest $1B in Coherent’s SiC business
Tuesday 10th October 2023
TiO2 enhances Ga2O3 diodes
Monday 9th October 2023
Webinar: Hydrogen Generation Industry Innovations to Meet Expanding North American Fab Hydrogen Requirements
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