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Thursday 6th July 2023
Micro-transfer printing for heterogeneous PICs
Thursday 6th July 2023
GaN chip firms confirm continued supply
Thursday 6th July 2023
3D-Micromac shows latest tools at Semicon West
Thursday 6th July 2023
From atoms to new materials
Wednesday 5th July 2023
Renesas and Wolfspeed sign 10 year SiC wafer agreement
Tuesday 4th July 2023
China to put export controls on compound semi materials
Tuesday 4th July 2023
Advancing the InGaAs MOSFET
Monday 3rd July 2023
Indian GaN centre installs Oxford Instruments tools
Monday 3rd July 2023
NexGen and General Motors get DOE grant
Monday 3rd July 2023
DISCO develops KABRA process for GaN wafers
Monday 3rd July 2023
OnePlus uses Innoscience bidirectional VGaN HEMTs
Monday 3rd July 2023
Sivers Photonics receives $1m from Ayar Labs
Monday 3rd July 2023
Navitas and Plexim accelerate time-to-market
Thursday 29th June 2023
Thermo Scientific announces new STEM metrology tool
Thursday 29th June 2023
Perovskite solar cells achieve record efficiency
Thursday 29th June 2023
STIHL awards Infineon 'Supplier of the Year '
Thursday 29th June 2023
Transphorm Q4 and yearly revenue down
Thursday 29th June 2023
Toyoda Gosei and Powdec develop horizontal GaN device
Thursday 29th June 2023
CEA-Leti and Intel to develop 2D TMDs on 300mm wafers
Wednesday 28th June 2023
NREL awards $2M for CdTe PV research
Wednesday 28th June 2023
European team integrates GaSb lasers into PIC chips
Wednesday 28th June 2023
Quantum Foundry orders Veeco MBE system
Wednesday 28th June 2023
Diodes Inc announces automotive SiC MOSFETs
Tuesday 27th June 2023
Substrates market to exceed $264M by 2028
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