EV Group - Expanding

Located in Schaerding Austria, EV Group manufactures wafer processing equipment targeted to the 3D integration, MEMS and compound semiconductor markets. In 2011, the company experienced 40% growth and now dominates the market for wafer bonding. As a result, the company recently completed an expansion at its World Headquarters that nearly doubled the size of the existing facility. 3D InCites visited the new site and spoke with Werner Thallner and Markus Wimplinger to learn more about the expansion itself, and the drivers behind this accelerated growth.