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Thursday 21st July 2022
TubeSolar and ZSW achieve perovskite milestone
Thursday 21st July 2022
Aixtron ships MOCVD system to University of Texas
Tuesday 19th July 2022
Palomar Technologies Expands Innovation Center in Singapore
Tuesday 19th July 2022
Who is playing the power GaN game?
Tuesday 19th July 2022
Rohde & Schwarz announces on-wafer device characterization test solution
Tuesday 19th July 2022
Anritsu and Yotavis launch a unique open lab
Tuesday 19th July 2022
Innoscience signs distribution agreement with Finepower
Monday 18th July 2022
Cubic GaN on large-area silicon (100) dies
Friday 15th July 2022
k-Space receives multi-million-dollar metrology order
Thursday 14th July 2022
ROHM’s SiC technology empowers SEMIKRON’s eMPack
Thursday 14th July 2022
Market for Automotive SiC Power Components to Exceed US$1 Billion in 2022
Wednesday 13th July 2022
Bosch to invest €3billion in chip business
Wednesday 13th July 2022
ST Hosts 'Electronique 2030' Program
Wednesday 13th July 2022
ACM Introduces SiC wafer Cleaning Tool
Wednesday 13th July 2022
Glasgow team makes 'electronic skin' from GaAs
Wednesday 13th July 2022
Soitec boosts SiC yields with KLA tools
Tuesday 12th July 2022
EVG achieves die-to-wafer fusion and hybrid bonding.
Tuesday 12th July 2022
Navitas Acquires VDD Tech
Tuesday 12th July 2022
Plasma-Therm Rolls Out Redesigned Heatpulse Platform
Tuesday 12th July 2022
Acidic ammonothermal growth promises cheaper GaN
Tuesday 12th July 2022
CSA Catapult and Siemens establish power partnership
Tuesday 12th July 2022
Obducat announces SiC processing order
Tuesday 12th July 2022
AGIC Capital Completes Eulitha investment
Tuesday 12th July 2022
ClassOne extends Solstice Surface Prep Tech
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