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Friday 13th February 2009
Using III-V cell bonding expertise gained in the space solar industry, CHAD Industries is set to increase concentrating photovoltaic manufacturing throughput.
Thursday 12th February 2009
Better wafer quality will drive large scale sales of solid-state light sources into air and water disinfection from 2010 onwards, says market analyst Yole Developpement
Thursday 12th February 2009
The TriQuint CEO says that now is time to invest – and not just in cost-cutting, but also in future business opportunities.
Wednesday 11th February 2009
Innovative carbon monolayer production method avoids high-vacuum annealing and opens the subject up to a wider range of researchers.
Tuesday 10th February 2009
Epitaxy equipment vendor further outsources MOCVD systems manufacturing from New Jersey, and cuts total workforce by one quarter.
Tuesday 10th February 2009
Triple-junction cell sales are resisting the recession, but with its optical communications business continuing to shrink could a mystery investor be the company's salvation?
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Friday 6th February 2009
Having taken over the SEMI-GAS product line from Matheson Tri-Gas last month, Applied Energy Systems is hopeful of expansion in the face of the global recession.
Friday 6th February 2009
Cost cutting and production ramps for energy management and smartphones help the radio-frequency chipmaker to profit.
Friday 6th February 2009
In our December issue we incorrectly reported that QPC Lasers had filed for bankruptcy. In fact, the Californian company remains a going concern, and is currently in negotiations with creditors and investors to secure its future.
Thursday 5th February 2009
Production is due to ramp through 2009 on record-efficiency devices addressing the 3G and 4G wireless infrastructure market.
Wednesday 4th February 2009
Fabless chipmaker says faster transmission speeds will bring optical technologies to the forefront in meeting the latest communications standards.
Tuesday 3rd February 2009
Models flesh out the extent of benefits from m-plane substrates for the solid-state illumination central to Ostendo's innovative imaging.
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Monday 2nd February 2009
The Japanese company's latest lab results on show at the Photonics West event include an LED that pushes performance limits and a 3 W blue laser diode.
Friday 30th January 2009
Executive without claimed MBA or Bachelor's penalized by nearly $800,000, but keeps his job based on track record.
Friday 30th January 2009
KLA-Tencor sees LEDs as the only prospect for growth of its inspection business, while Ultratech will launch the lowest-cost projection steppers yet into the same market in 2009.
Thursday 29th January 2009
Display giant calls on leading US solid-state lighting company to help it produce LED backlights internally.
Wednesday 28th January 2009
Plenary speaker at Photonics West advocates use of non-polar substrates, but cautions on high defect levels in epilayers grown on native GaN.
Wednesday 28th January 2009
Fab utilization plummets to just 30 percent and write-downs prompt a huge net loss, but the world's leading maker of GaAs components is finally seeing some stability amid the global turmoil.
Info
Wednesday 28th January 2009
The rumor that refused to go away finally becomes reality, as the two optical communication component vendors agree to merge.
Tuesday 27th January 2009
The vertically integrated manufacturer believes that avoiding packaging LED die before producing arrays is a key step towards lamps that compete effectively with compact fluorescent bulbs.
Tuesday 27th January 2009
US Department of Energy study concludes that LED-based replacements for 4-foot fluorescent lamps do not emit enough light.
Tuesday 27th January 2009
With the cellphone handset market in decline, high-end applications of LEDs and laser diodes look like the only growth areas for III-V electronics in 2009.
Monday 26th January 2009
But that doesn't stop Lumileds' parent company from writing down the value of its LED manufacturing subsidiary by €232 million, and cutting 6000 jobs across the wider company.
Thursday 22nd January 2009
Using amorphous silicon passivation on the intricate transistors improves carrier mobility and yields promising candidates for post-silicon logic.

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