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Tuesday 9th May 2023
Webinar: Multimodal spectroscopic characterisation of large wafers
Tuesday 9th May 2023
Innoscience and BFH develop multilevel topology design
Tuesday 9th May 2023
Infineon announces 600V GIT HEMTs
Tuesday 9th May 2023
Microchip SiC E-Fuse protects EVs
Tuesday 9th May 2023
Navitas announces 650V SiC diodes
Tuesday 9th May 2023
Infineon CoolSiC modules target electric trains
Tuesday 9th May 2023
Transphorm reveals first 1200V GaN-on-sapphire model
Tuesday 9th May 2023
EPC releases BLDC inverter reference design
Tuesday 9th May 2023
Onsemi announces next gen 1200V EliteSiC devices
Tuesday 9th May 2023
Rohm begins mass producing 650V GaN HEMTs
Monday 8th May 2023
Smartphone shipments slump
Monday 8th May 2023
Infineon and Foxconn to collaborate on SiC for EVs
Thursday 4th May 2023
What hinders UVC LED adoption?
Thursday 4th May 2023
Mouser and Navitas sign distribution agreement
Thursday 4th May 2023
AXT announces lower revenues in Q1
Thursday 4th May 2023
CVD Equipment releases SiC PVT system
Wednesday 3rd May 2023
BAE Systems and Eaton collaborate on EV trucks
Wednesday 3rd May 2023
CGD scale-ups presence at PCIM 2023
Wednesday 3rd May 2023
Infineon signs deals with two Chinese SiC suppliers
Tuesday 2nd May 2023
Innoscience demos GaN applications at PCIM
Tuesday 2nd May 2023
Transphorm introduces pin-compatible SuperGaN FETs
Tuesday 2nd May 2023
Onsemi focuses on sustainable power at PCIM
Tuesday 2nd May 2023
EPC and ADI introduce reference design
Tuesday 2nd May 2023
Asian MBE order for RIber
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